Rajesh Kumar Malhan

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
SiC semiconductor device having CJFET and method for manufacturing...
- Patent number 8,748,948
- Issue date Jun 10, 2014
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,604,540
- Issue date Dec 10, 2013
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing th...
- Patent number 8,575,648
- Issue date Nov 5, 2013
- Denso Corporation
- Yuuichi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with junction field-effect transistor and manu...
- Patent number 8,519,452
- Issue date Aug 27, 2013
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic package having two substrates with multiple semico...
- Patent number 8,432,030
- Issue date Apr 30, 2013
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having D mode JFET and E mode JFET and method...
- Patent number 8,373,209
- Issue date Feb 12, 2013
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band gap semiconductor device including junction field effect...
- Patent number 8,274,086
- Issue date Sep 25, 2012
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic material and electronic device
- Patent number 8,194,392
- Issue date Jun 5, 2012
- Denso Corporation
- Rajesh Kumar Malhan
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Power electronic package having two substrates with multiple semico...
- Patent number 7,999,369
- Issue date Aug 16, 2011
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic package having two substrates with multiple electr...
- Patent number 7,557,434
- Issue date Jul 7, 2009
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal conductor in ohmic contact with...
- Patent number 7,335,928
- Issue date Feb 26, 2008
- Hitachi, Ltd.
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a vertical field effect transistor,...
- Patent number 7,307,313
- Issue date Dec 11, 2007
- Hitachi, Ltd.
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having trench in sili...
- Patent number 7,241,694
- Issue date Jul 10, 2007
- Denso Corporation
- Yuuichi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal conductor in ohmic contact with...
- Patent number 7,230,283
- Issue date Jun 12, 2007
- Hitachi, Ltd.
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an ohmic contact in wide band semiconductor
- Patent number 7,141,498
- Issue date Nov 28, 2006
- Denso Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH JUNCTION FIELD-EFFECT TRANSISTOR AND MANU...
- Publication number 20120080728
- Publication date Apr 5, 2012
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICO...
- Publication number 20110254177
- Publication date Oct 20, 2011
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC SEMICONDUCTOR DEVICE HAVING CJFET AND METHOD FOR MANUFACTURING...
- Publication number 20110198612
- Publication date Aug 18, 2011
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186861
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having JFET and method for manufacturing the same
- Publication number 20110156052
- Publication date Jun 30, 2011
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING D MODE JFET AND E MODE JFET AND METHOD...
- Publication number 20110156053
- Publication date Jun 30, 2011
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...
- Publication number 20110156054
- Publication date Jun 30, 2011
- DENSO CORPORATION
- Yuuichi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110133211
- Publication date Jun 9, 2011
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MATERIAL AND ELECTRONIC DEVICE
- Publication number 20110002083
- Publication date Jan 6, 2011
- DENSO CORPORATION
- Rajesh Kumar MALHAN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Wide band gap semiconductor device including junction field effect...
- Publication number 20100025693
- Publication date Feb 4, 2010
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power electronic package having two substrates with multiple semico...
- Publication number 20080054439
- Publication date Mar 6, 2008
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power electronic package having two substrates with multiple electr...
- Publication number 20080054425
- Publication date Mar 6, 2008
- DENSO CORPORATION
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices
- Publication number 20070221924
- Publication date Sep 27, 2007
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an ohmic contact in wide band semiconductor
- Publication number 20060205195
- Publication date Sep 14, 2006
- DENSO Corporation
- Rajesh Kumar Malhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060076613
- Publication date Apr 13, 2006
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices
- Publication number 20060060884
- Publication date Mar 23, 2006
- Takasumi Ohyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device having trench in sili...
- Publication number 20050233539
- Publication date Oct 20, 2005
- Yuuichi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS

Rajesh Kumar Malhan

Person

Patents Grantslast 30 patents

SiC semiconductor device having CJFET and method for manufacturing...

Semiconductor device and method of manufacturing the same

Silicon carbide semiconductor device and method of manufacturing th...

Semiconductor device with junction field-effect transistor and manu...

Power electronic package having two substrates with multiple semico...

Semiconductor device having D mode JFET and E mode JFET and method...

Wide band gap semiconductor device including junction field effect...

Ceramic material and electronic device

Power electronic package having two substrates with multiple semico...

Power electronic package having two substrates with multiple electr...

Semiconductor device having a metal conductor in ohmic contact with...

Semiconductor device including a vertical field effect transistor,...

Method for manufacturing semiconductor device having trench in sili...

Semiconductor device having a metal conductor in ohmic contact with...

Method of forming an ohmic contact in wide band semiconductor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH JUNCTION FIELD-EFFECT TRANSISTOR AND MANU...

POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICO...

SIC SEMICONDUCTOR DEVICE HAVING CJFET AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having JFET and method for manufacturing the same

SEMICONDUCTOR DEVICE HAVING D MODE JFET AND E MODE JFET AND METHOD...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CERAMIC MATERIAL AND ELECTRONIC DEVICE

Wide band gap semiconductor device including junction field effect...

Power electronic package having two substrates with multiple semico...

Power electronic package having two substrates with multiple electr...

Semiconductor devices

Method of forming an ohmic contact in wide band semiconductor

Semiconductor device

Semiconductor devices

Method for manufacturing semiconductor device having trench in sili...