Rajesh Mandamparambil

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Eindhoven, NL

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Patents Applicationslast 30 patents

Information Patent Application
ON-CHIP SHIELDED DEVICE
- Publication number 20240237316
- Publication date Jul 11, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP SHIELDED DEVICE
- Publication number 20240138129
- Publication date Apr 25, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
- Publication number 20230402410
- Publication date Dec 14, 2023
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
- Publication number 20230290737
- Publication date Sep 14, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20220384943
- Publication date Dec 1, 2022
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE DESIGN FOR DIFFERENT POLARIZATIONS
- Publication number 20220311137
- Publication date Sep 29, 2022
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM MULTI-PACKAGE ANTENNA ARRAY
- Publication number 20220263222
- Publication date Aug 18, 2022
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS