Rajesh Srinivasan

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Flexible substrate for packaging a semiconductor component
- Patent number 6,300,679
- Issue date Oct 9, 2001
- Semiconductor Components Industries, LLC
- Prosanto K. Mukerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 6,093,583
- Issue date Jul 25, 2000
- Semiconductor Components Industries, LLC
- Prosanto K. Mukerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation method
- Patent number 5,930,652
- Issue date Jul 27, 1999
- Motorola, Inc.
- Prosanto K. Mukerji
- H01 - BASIC ELECTRIC ELEMENTS