Rajiv Dunne

Person

Murphy, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,165,873
- Issue date Oct 20, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,142,496
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial four-point probe for low resistance measurements
- Patent number 9,030,216
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Grant
Process of making a stacked semiconductor package having a clip
- Patent number 8,883,567
- Issue date Nov 11, 2014
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,436,475
- Issue date May 7, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,431,481
- Issue date Apr 30, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die assemblies including TSV die
- Patent number 8,313,982
- Issue date Nov 20, 2012
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,178,976
- Issue date May 15, 2012
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial four-point probe for low resistance measurements
- Patent number 8,174,276
- Issue date May 8, 2012
- Texas Instruments Incorporated
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Grant
Packaged electronic devices with face-up die having TSV connection...
- Patent number 8,154,134
- Issue date Apr 10, 2012
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual carrier for joining IC die or wafers to TSV wafers
- Patent number 8,017,439
- Issue date Sep 13, 2011
- Texas Instruments Incorporated
- Yoshimi Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding IC die to TSV wafers
- Patent number 7,915,080
- Issue date Mar 29, 2011
- Texas Instruments Incorporated
- Yoshimi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked flip-assembled semiconductor chips embedded in thin hybrid...
- Patent number 7,898,069
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Rajiv C Dunne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder cap application process on copper bump using solder powder film
- Patent number 7,790,597
- Issue date Sep 7, 2010
- Texas Instruments Incorporated
- Satyendra S. Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,572,677
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-flip-assembled semiconductor chips embedded in thin hybrid...
- Patent number 7,504,283
- Issue date Mar 17, 2009
- Texas Instruments Incorporated
- Rajiv Carl Dunne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,126,217
- Issue date Oct 24, 2006
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Package
- Publication number 20130256852
- Publication date Oct 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120202321
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coaxial Four-Point Probe for Low Resistance Measurements
- Publication number 20120194208
- Publication date Aug 2, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120193814
- Publication date Aug 2, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ASSEMBLIES INCLUDING TSV DIE
- Publication number 20120070939
- Publication date Mar 22, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS
- Publication number 20110183464
- Publication date Jul 28, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Yoshimi Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING IC DIE TO TSV WAFERS
- Publication number 20100159643
- Publication date Jun 24, 2010
- TEXAS INSTRUMENTS INCORPORATED
- YOSHIMI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Reliable Solder Joints
- Publication number 20090297879
- Publication date Dec 3, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL FOUR-POINT PROBE FOR LOW RESISTANCE MEASUREMENTS
- Publication number 20090289648
- Publication date Nov 26, 2009
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...
- Publication number 20090278245
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- THOMAS D. BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION
- Publication number 20090278244
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- RAJIV DUNNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID...
- Publication number 20090166832
- Publication date Jul 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Carl Dunne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CAP APPLICATION PROCESS ON COPPER BUMP USING SOLDER POWDER FILM
- Publication number 20090014898
- Publication date Jan 15, 2009
- Satyendra S. Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED-FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID...
- Publication number 20080142940
- Publication date Jun 19, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Carl Dunne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...
- Publication number 20070004083
- Publication date Jan 4, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Publication number 20060027921
- Publication date Feb 9, 2006
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Rajiv Dunne

Person

Patents Grantslast 30 patents

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Coaxial four-point probe for low resistance measurements

Process of making a stacked semiconductor package having a clip

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

Stacked die assemblies including TSV die

IC device having low resistance TSV comprising ground connection

Coaxial four-point probe for low resistance measurements

Packaged electronic devices with face-up die having TSV connection...

Dual carrier for joining IC die or wafers to TSV wafers

Bonding IC die to TSV wafers

Stacked flip-assembled semiconductor chips embedded in thin hybrid...

Solder cap application process on copper bump using solder powder film

Arrangement in semiconductor packages for inhibiting adhesion of li...

Stacked-flip-assembled semiconductor chips embedded in thin hybrid...

Arrangement in semiconductor packages for inhibiting adhesion of li...

Patents Applicationslast 30 patents

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

Stacked Semiconductor Package

IC Device Having Low Resistance TSV Comprising Ground Connection

Coaxial Four-Point Probe for Low Resistance Measurements

IC Device Having Low Resistance TSV Comprising Ground Connection

STACKED DIE ASSEMBLIES INCLUDING TSV DIE

DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

BONDING IC DIE TO TSV WAFERS

Structure and Method for Reliable Solder Joints

COAXIAL FOUR-POINT PROBE FOR LOW RESISTANCE MEASUREMENTS

PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...

IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION

STACKED FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID...

SOLDER CAP APPLICATION PROCESS ON COPPER BUMP USING SOLDER POWDER FILM

STACKED-FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID...

Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...

Arrangement in semiconductor packages for inhibiting adhesion of li...