Rajkumar JAKKARAJU

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Deposition methods for uniform and conformal hybrid titanium oxide...
- Patent number 9,881,787
- Issue date Jan 30, 2018
- Applied Materials, Inc.
- Chien-Teh Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lowering tungsten resistivity by replacing titanium nitride with ti...
- Patent number 9,583,349
- Issue date Feb 28, 2017
- APPLIED MATERIALS, INC.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition using spatial atomic layer deposition or pulsed che...
- Patent number 9,514,933
- Issue date Dec 6, 2016
- Applied Materials, Inc.
- Yu Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten silicide nitride films and methods of formation
- Patent number 9,461,137
- Issue date Oct 4, 2016
- Applied Materials, Inc.
- Jothilingam Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD ALN film with oxygen doping for a low etch rate hardmask film
- Patent number 9,162,930
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- Yong Cao
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Systems and methods for selective tungsten deposition in vias
- Patent number 8,778,797
- Issue date Jul 15, 2014
- Novellus Systems, Inc.
- Juwen Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Deposition Methods For Uniform And Conformal Hybrid Titanium Oxide...
- Publication number 20160372324
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Chien-Teh Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOWERING TUNGSTEN RESISTIVITY BY REPLACING TITANIUM NITRIDE WITH TI...
- Publication number 20150206756
- Publication date Jul 23, 2015
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film Deposition Using Spatial Atomic Layer Deposition Or Pulsed Che...
- Publication number 20150194298
- Publication date Jul 9, 2015
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A METAL DIELECTRIC ETCHING STOP LAYER ON A SUBST...
- Publication number 20150114827
- Publication date Apr 30, 2015
- Applied Materials, Inc.
- Yong CAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOWERING TUNGSTEN RESISTIVITY BY REPLACING TITANIUM NITRIDE WITH TI...
- Publication number 20140001576
- Publication date Jan 2, 2014
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD ALN FILM WITH OXYGEN DOPING FOR A LOW ETCH RATE HARDMASK FILM
- Publication number 20130296158
- Publication date Nov 7, 2013
- Yong CAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE TUNGSTEN DEPOSITION IN VIAS
- Publication number 20120077342
- Publication date Mar 29, 2012
- Juwen Gao
- H01 - BASIC ELECTRIC ELEMENTS

Rajkumar JAKKARAJU

Person

Patents Grantslast 30 patents

Deposition methods for uniform and conformal hybrid titanium oxide...

Lowering tungsten resistivity by replacing titanium nitride with ti...

Film deposition using spatial atomic layer deposition or pulsed che...

Tungsten silicide nitride films and methods of formation

PVD ALN film with oxygen doping for a low etch rate hardmask film

Systems and methods for selective tungsten deposition in vias

Patents Applicationslast 30 patents

Deposition Methods For Uniform And Conformal Hybrid Titanium Oxide...

LOWERING TUNGSTEN RESISTIVITY BY REPLACING TITANIUM NITRIDE WITH TI...

Film Deposition Using Spatial Atomic Layer Deposition Or Pulsed Che...

METHODS OF FORMING A METAL DIELECTRIC ETCHING STOP LAYER ON A SUBST...

LOWERING TUNGSTEN RESISTIVITY BY REPLACING TITANIUM NITRIDE WITH TI...

PVD ALN FILM WITH OXYGEN DOPING FOR A LOW ETCH RATE HARDMASK FILM

SYSTEMS AND METHODS FOR SELECTIVE TUNGSTEN DEPOSITION IN VIAS