Rajneesh Kumar

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill method and chip package
- Patent number 8,492,910
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform solder reflow fixture
- Patent number 8,444,043
- Issue date May 21, 2013
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip assembly method employing post-contact differential heating
- Patent number 8,381,966
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Rajneesh Kumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill method and chip package
- Patent number 8,129,230
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible thermal thickening grease
- Patent number 7,981,849
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Low compressive force, non-silicone, high thermal conducting formul...
- Patent number 7,816,785
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal conducting formulations
- Patent number 7,641,811
- Issue date Jan 5, 2010
- International Business Machines Corporation
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal conducting formulations
- Patent number 7,462,294
- Issue date Dec 9, 2008
- International Business Machines Corporation
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP ASSEMBLY METHOD EMPLOYING POST-CONTACT DIFFERENTIAL HEATING
- Publication number 20120217287
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Rajneesh Kumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERFILL METHOD AND CHIP PACKAGE
- Publication number 20120119353
- Publication date May 17, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL METHOD AND CHIP PACKAGE
- Publication number 20110037181
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMUL...
- Publication number 20100181663
- Publication date Jul 22, 2010
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED THERMAL CONDUCTING FORMULATIONS
- Publication number 20080311381
- Publication date Dec 18, 2008
- International Business Machines Corporation
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED THERMAL CONDUCTING FORMULATIONS
- Publication number 20080266809
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE THERMAL THICKENING GREASE
- Publication number 20080220998
- Publication date Sep 11, 2008
- IBM CORPORATION (YORKTOWN)
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...

Rajneesh Kumar

Person

Patents Grantslast 30 patents

Underfill method and chip package

Uniform solder reflow fixture

Flip chip assembly method employing post-contact differential heating

Underfill method and chip package

Reversible thermal thickening grease

Low compressive force, non-silicone, high thermal conducting formul...

Enhanced thermal conducting formulations

Enhanced thermal conducting formulations

Patents Applicationslast 30 patents

FLIP CHIP ASSEMBLY METHOD EMPLOYING POST-CONTACT DIFFERENTIAL HEATING

UNDERFILL METHOD AND CHIP PACKAGE

UNDERFILL METHOD AND CHIP PACKAGE

LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMUL...

ENHANCED THERMAL CONDUCTING FORMULATIONS

ENHANCED THERMAL CONDUCTING FORMULATIONS

REVERSIBLE THERMAL THICKENING GREASE