Raju Ahmed

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assemblies having conductive interconnects which are laterally and...
- Patent number 12,014,983
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,990,370
- Issue date May 21, 2024
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,978,527
- Issue date May 7, 2024
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,545,391
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,515,204
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive interconnects which are laterally and...
- Patent number 11,482,492
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,328,749
- Issue date May 10, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20240282702
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20240258167
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20230113573
- Publication date Apr 13, 2023
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20230058288
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20230021072
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20220208606
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20220199123
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20220013449
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210249304
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210193189
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Assemblies having conductive interconnects which are laterally and...

Methods for forming conductive vias, and associated devices and sys...

Conductive interconnects and methods of forming conductive intercon...

Conductive interconnects and methods of forming conductive intercon...

Methods for forming conductive vias, and associated devices and sys...

Assemblies having conductive interconnects which are laterally and...

Conductive interconnects and methods of forming conductive intercon...

Patents Applicationslast 30 patents

Assemblies having Conductive Interconnects which are Laterally and...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Assemblies having Conductive Interconnects which are Laterally and...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Assemblies having Conductive Interconnects which are Laterally and...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Conductive Interconnects and Methods of Forming Conductive Intercon...