Ralf B. Willecke

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Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Bi-layer etch stop process for defect reduction and via stress migr...
- Patent number 7,423,344
- Issue date Sep 9, 2008
- Texas Instruments Incorporated
- Tae S. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer etch stop process for defect reduction and via stress migr...
- Patent number 7,199,047
- Issue date Apr 3, 2007
- Texas Instruments Incorporated
- Tae S. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel silicide—silicon nitride adhesion through surface pa...
- Patent number 6,831,008
- Issue date Dec 14, 2004
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bi-layer etch stop process for defect reduction and via stress migr...
- Publication number 20070134918
- Publication date Jun 14, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Tae S. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-layer etch stop process for defect reduction and via stress migr...
- Publication number 20050274955
- Publication date Dec 15, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Tae S. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel silicide - silicon nitride adhesion through surface passivation
- Publication number 20050090087
- Publication date Apr 28, 2005
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel silicide - silicon nitride adhesion through surface passivation
- Publication number 20040061184
- Publication date Apr 1, 2004
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS