Ralf Otremba

Person

Kaufbeuren, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-device semiconductor chip with electrical access to devices a...
- Patent number 12,136,623
- Issue date Nov 5, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with multi-device cooling
- Patent number 12,068,226
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising side walls connected with c...
- Patent number 11,978,693
- Issue date May 7, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with dual integrated heat spreaders
- Patent number 11,929,298
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming a semiconductor package
- Patent number 11,715,719
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor assembly and method for fabric...
- Patent number 11,676,881
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,605,577
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistor packages with exposed source and drain cont...
- Patent number 11,600,558
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,355,424
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a multi-chip power semiconductor device
- Patent number 11,329,000
- Issue date May 10, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,217,510
- Issue date Jan 4, 2022
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
- Patent number 11,211,304
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an SMD package with top side cooling
- Patent number 10,903,133
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip monolithically integrated wit...
- Patent number 10,763,246
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package top-side-cooling
- Patent number 10,755,999
- Issue date Aug 25, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...
- Publication number 20240162125
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240087995
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...
- Publication number 20230402423
- Publication date Dec 14, 2023
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device
- Publication number 20230268255
- Publication date Aug 24, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
- Publication number 20230230903
- Publication date Jul 20, 2023
- INFINEON TECHNOLOGIES AG
- Hooi Boon TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Bidirectional Switch
- Publication number 20230197582
- Publication date Jun 22, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
- Publication number 20230187326
- Publication date Jun 15, 2023
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOSTAT SOCKET FOR HOLDING AN ION TRAP DEVICE MOUNTED ON A SUBSTRA...
- Publication number 20230168023
- Publication date Jun 1, 2023
- Infineon Technologies Austria AG
- Günther Lohmann
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH MULTI-DEVICE COOLING
- Publication number 20230079413
- Publication date Mar 16, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOAD TERMINALS ON WHICH COUPLED POWER COMPONENT AND LO...
- Publication number 20220173023
- Publication date Jun 2, 2022
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...
- Publication number 20220173006
- Publication date Jun 2, 2022
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH DUAL INTEGRATED HEAT SPREADERS
- Publication number 20220157686
- Publication date May 19, 2022
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Semiconductor Chip with Electrical Access to Devices a...
- Publication number 20220149038
- Publication date May 12, 2022
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
- Publication number 20220148934
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20220102253
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Thomas Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Bidirectional Switch
- Publication number 20220093496
- Publication date Mar 24, 2022
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising Side Walls Connected with C...
- Publication number 20220037240
- Publication date Feb 3, 2022
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20210134708
- Publication date May 6, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20210118843
- Publication date Apr 22, 2021
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Chip Package
- Publication number 20210074614
- Publication date Mar 11, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Ralf Otremba

Person

Patents Grantslast 30 patents

Multi-device semiconductor chip with electrical access to devices a...

Semiconductor assembly with multi-device cooling

Chip package and semiconductor arrangement having thermally conduct...

Semiconductor package having a chip carrier with a pad offset feature

Semiconductor device package comprising side walls connected with c...

Linear spacer for spacing a carrier of a package

Molded semiconductor package with dual integrated heat spreaders

Semiconductor device including a bidirectional switch

Semiconductor device having a carrier, semiconductor chip packages...

Method for fabricating a semiconductor device by using different co...

Method of fabricating a semiconductor package

Semiconductor package and method of forming a semiconductor package

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor package, semiconductor assembly and method for fabric...

Semiconductor device including a bidirectional switch

Plurality of transistor packages with exposed source and drain cont...

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum layer

Multi-chip package

Package for a multi-chip power semiconductor device

Semiconductor package and method of fabricating a semiconductor pac...

Semiconductor device including a bidirectional switch

Assembly and method for mounting an electronic component to a subst...

Method of producing an SMD package with top side cooling

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Semiconductor package system

Device including a semiconductor chip monolithically integrated wit...

Multi-package top-side-cooling

Method of manufacturing a package having a power semiconductor chip

Patents Applicationslast 30 patents

POWER TRANSISTOR CHIP PACKAGE

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...

Method for Fabricating a Power Semiconductor Device

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...

MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Power Semiconductor Device

SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...

Semiconductor Device Including a Bidirectional Switch

SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...

CRYOSTAT SOCKET FOR HOLDING AN ION TRAP DEVICE MOUNTED ON A SUBSTRA...

SEMICONDUCTOR ASSEMBLY WITH MULTI-DEVICE COOLING

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

PACKAGE WITH LOAD TERMINALS ON WHICH COUPLED POWER COMPONENT AND LO...

CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...

MOLDED SEMICONDUCTOR PACKAGE WITH DUAL INTEGRATED HEAT SPREADERS

Multi-Device Semiconductor Chip with Electrical Access to Devices a...

LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...

Semiconductor Device Including a Bidirectional Switch

Semiconductor Device Package Comprising Side Walls Connected with C...

Power Semiconductor Device and Method for Fabricating a Power Semic...

Method for Fabricating a Semiconductor Device by Using Different Co...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Multi-Chip Package