Ralf Wombacher

Person

Burglengenfeld, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,734,351
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,056,348
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip assembly
- Patent number 9,530,754
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 9,379,033
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a chip package, chip package, method of man...
- Patent number 9,159,701
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 9,123,708
- Issue date Sep 1, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 8,980,687
- Issue date Mar 17, 2015
- Infineon Technologies AG
- Ivan Nikitin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip arrangement, a method for forming a chip arrangement, a chip p...
- Patent number 8,847,385
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 8,674,462
- Issue date Mar 18, 2014
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 7,847,375
- Issue date Dec 7, 2010
- Infineon Technologies AG
- Joachim Mahler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with semiconductor device components embedded...
- Patent number 7,705,472
- Issue date Apr 27, 2010
- Infineon Technologies, AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing it, and use of an ele...
- Patent number 7,645,636
- Issue date Jan 12, 2010
- Infineon Technologies AG
- Ralf Wombacher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20220238481
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production Method for a Component
- Publication number 20210351319
- Publication date Nov 11, 2021
- OSRAM OLED GmbH
- Ralf Wombacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20200321309
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20180358326
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembling on adhesion layer or dielectric layer, extending be...
- Publication number 20170294403
- Publication date Oct 12, 2017
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP ASSEMBLY
- Publication number 20160035700
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembling on adhesion layer or dielectric layer, extending be...
- Publication number 20150221569
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...
- Publication number 20150076672
- Publication date Mar 19, 2015
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package
- Publication number 20140246766
- Publication date Sep 4, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURIN...
- Publication number 20130337614
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR FORMING A CHIP ARRANGEMENT, A CHIP P...
- Publication number 20130256855
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing Thereof
- Publication number 20130200502
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic Device and Method of Manufacturing Same
- Publication number 20100032816
- Publication date Feb 11, 2010
- INFINEON TECHNOLOGIES AG
- Joachim MAHLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE
- Publication number 20090026560
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device with Semiconductor Device Components Embedded...
- Publication number 20070145606
- Publication date Jun 28, 2007
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING IT, AND USE OF AN ELE...
- Publication number 20070108637
- Publication date May 17, 2007
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- H01 - BASIC ELECTRIC ELEMENTS

Ralf Wombacher

Person

Patents Grantslast 30 patents

Chip assembling on adhesion layer or dielectric layer, extending be...

Chip assembling on adhesion layer or dielectric layer, extending be...

Chip assembling on adhesion layer or dielectric layer, extending be...

Chip assembling on adhesion layer or dielectric layer, extending be...

Chip package and chip assembly

Sensor package

Method of manufacturing a chip package, chip package, method of man...

Semiconductor chip package

Semiconductor device and method of manufacturing thereof

Chip arrangement, a method for forming a chip arrangement, a chip p...

Sensor package

Electronic device and method of manufacturing same

Semiconductor device with semiconductor device components embedded...

Semiconductor device and method for producing it, and use of an ele...

Patents Applicationslast 30 patents

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

Production Method for a Component

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

Chip assembling on adhesion layer or dielectric layer, extending be...

CHIP PACKAGE AND CHIP ASSEMBLY

Chip assembling on adhesion layer or dielectric layer, extending be...

METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...

Semiconductor Chip Package

SENSOR PACKAGE

METHODS FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURIN...

CHIP ARRANGEMENT, A METHOD FOR FORMING A CHIP ARRANGEMENT, A CHIP P...

Semiconductor Device and Method of Manufacturing Thereof

Electronic Device and Method of Manufacturing Same

SENSOR PACKAGE

Semiconductor Device with Semiconductor Device Components Embedded...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING IT, AND USE OF AN ELE...