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RALPH HELLER
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RUESCHLIKON, CH
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package assembly comprising a stack of slanted i...
Patent number
10,321,580
Issue date
Jun 11, 2019
International Business Machines Corporation
Ralph Heller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a printed circuit board assembly
Patent number
9,832,874
Issue date
Nov 28, 2017
International Business Machines Corporation
Andreas C. Doering
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly of printed circuit boards
Patent number
9,414,493
Issue date
Aug 9, 2016
International Business Machines Corporation
Andreas C. Doering
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Integrated Circuit Package Assembly Comprising a Stack of Slanted I...
Publication number
20180035544
Publication date
Feb 1, 2018
International Business Machines Corporation
Ralph HELLER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ASSEMBLY OF PRINTED CIRCUIT BOARDS
Publication number
20150351256
Publication date
Dec 3, 2015
International Business Machines Corporation
ANDREAS C. DOERING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF PRINTED CIRCUIT BOARDS
Publication number
20150351242
Publication date
Dec 3, 2015
International Business Machines Corporation
ANDREAS C. DOERING
H01 - BASIC ELECTRIC ELEMENTS