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Ralph Salvatore Moyer
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Mohnton, PA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Packages for encapsulated semiconductor devices and method of makin...
Patent number
7,956,451
Issue date
Jun 7, 2011
Agere Systems Inc.
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with base features to reduce leakage
Patent number
7,541,669
Issue date
Jun 2, 2009
Agere Systems Inc.
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device package
Patent number
7,242,090
Issue date
Jul 10, 2007
Agere Systems Inc.
John M. Brennan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with reduced leakage
Patent number
7,224,047
Issue date
May 29, 2007
LSI Corporation
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnections to copper IC's
Patent number
6,620,720
Issue date
Sep 16, 2003
Agere Systems Inc.
Ralph Salvatore Moyer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor device package with base features to reduce leakage
Publication number
20070241433
Publication date
Oct 18, 2007
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having encapsulant dam with chamfered edge
Publication number
20060170079
Publication date
Aug 3, 2006
John McKenna Brennan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device package
Publication number
20060170095
Publication date
Aug 3, 2006
John M. Brennan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe designs for plastic cavity transistor packages
Publication number
20060145317
Publication date
Jul 6, 2006
John M. Brennan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages for encapsulated semiconductor devices and method of makin...
Publication number
20060131704
Publication date
Jun 22, 2006
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device package with reduced leakage
Publication number
20060131707
Publication date
Jun 22, 2006
Patrick Joseph Carberry
H01 - BASIC ELECTRIC ELEMENTS