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Ralph V. Vogelgesang
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Old Monroe, MO, US
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last 30 patents
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Patent Grant
Method for processing a semiconductor wafer
Patent number
6,227,944
Issue date
May 8, 2001
MEMC Electronics Materials, Inc.
Yun-Biao Xin
B24 - GRINDING POLISHING
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Patent Grant
Polishing pad and process for forming same
Patent number
6,179,950
Issue date
Jan 30, 2001
MEMC Electronic Materials, Inc.
Guoqiang (David) Zhang
B24 - GRINDING POLISHING
Information
Patent Grant
Method of conditioning wafer polishing pads
Patent number
6,135,863
Issue date
Oct 24, 2000
MEMC Electronic Materials, Inc.
David Zhang
B24 - GRINDING POLISHING