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Ram Viswanath
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
12,176,292
Issue date
Dec 24, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
No mold shelf package design and process flow for advanced package...
Patent number
12,087,731
Issue date
Sep 10, 2024
Intel Corporation
Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pitch translation architecture for semiconductor package including...
Patent number
12,051,647
Issue date
Jul 30, 2024
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
Patent number
11,984,377
Issue date
May 14, 2024
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
Patent number
11,935,808
Issue date
Mar 19, 2024
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC die with solderable thermal interface structures for assemblies...
Patent number
11,923,267
Issue date
Mar 5, 2024
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect architecture with silicon interposer and EMIB
Patent number
11,901,299
Issue date
Feb 13, 2024
Intel Corporation
Md Altaf Hossain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
No mold shelf package design and process flow for advanced package...
Patent number
11,901,333
Issue date
Feb 13, 2024
Intel Corporation
Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,817,390
Issue date
Nov 14, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pitch translation architecture for semiconductor package including...
Patent number
11,705,398
Issue date
Jul 18, 2023
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,640,942
Issue date
May 2, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coupled cooling fins in ultra-small systems
Patent number
11,574,851
Issue date
Feb 7, 2023
Intel Corporation
Aastha Uppal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect architecture with silicon interposer and EMIB
Patent number
11,557,541
Issue date
Jan 17, 2023
Intel Corporation
Md Altaf Hossain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,545,407
Issue date
Jan 3, 2023
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,302,643
Issue date
Apr 12, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pitch translation architecture for semiconductor package including...
Patent number
11,270,942
Issue date
Mar 8, 2022
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rlink—die to die channel interconnect configurations to improve sig...
Patent number
10,784,204
Issue date
Sep 22, 2020
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pitch translation architecture for semiconductor package including...
Patent number
10,643,945
Issue date
May 5, 2020
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures with recessed conductive contacts for...
Patent number
10,424,561
Issue date
Sep 24, 2019
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board with a recess to accommodate discrete compone...
Patent number
10,187,996
Issue date
Jan 22, 2019
Intel Corporation
Rajasekaran Swaminathan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit structures with recessed conductive contacts for...
Patent number
9,865,568
Issue date
Jan 9, 2018
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CPU package substrates with removable memory mechanical interfaces
Patent number
9,832,876
Issue date
Nov 28, 2017
Intel Corporation
Mani Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package connector assembly
Patent number
9,674,954
Issue date
Jun 6, 2017
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile zero/low insertion force package top side flex cable co...
Patent number
9,640,887
Issue date
May 2, 2017
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with narrow-factor via including finish layer
Patent number
9,603,247
Issue date
Mar 21, 2017
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming ultra thin package structures including low temp...
Patent number
9,461,014
Issue date
Oct 4, 2016
Intel Corporation
Sriram Srinivasan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D integrated circuit package with window interposer
Patent number
9,391,013
Issue date
Jul 12, 2016
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile zero/low insertion force package top side flex cable co...
Patent number
9,324,678
Issue date
Apr 26, 2016
Intel Corporation
Sanka Ganesan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit connectors
Patent number
9,265,170
Issue date
Feb 16, 2016
Intel Corporation
Rajasekaran Swaminathan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D integrated circuit package with window interposer
Patent number
9,129,958
Issue date
Sep 8, 2015
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT...
Publication number
20250006643
Publication date
Jan 2, 2025
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
Publication number
20240347457
Publication date
Oct 17, 2024
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
Publication number
20240145395
Publication date
May 2, 2024
Intel Corporation
MD Altaf HOSSAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
Publication number
20240136244
Publication date
Apr 25, 2024
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20240136326
Publication date
Apr 25, 2024
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20240030142
Publication date
Jan 25, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
Publication number
20230290728
Publication date
Sep 14, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20230238355
Publication date
Jul 27, 2023
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20230134770
Publication date
May 4, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
Publication number
20230107106
Publication date
Apr 6, 2023
Intel Corporation
MD Altaf HOSSAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...
Publication number
20230086356
Publication date
Mar 23, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20220181262
Publication date
Jun 9, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
Publication number
20220148968
Publication date
May 12, 2022
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
Publication number
20210305120
Publication date
Sep 30, 2021
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20210305162
Publication date
Sep 30, 2021
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES...
Publication number
20210305119
Publication date
Sep 30, 2021
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
Publication number
20210305121
Publication date
Sep 30, 2021
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20210104490
Publication date
Apr 8, 2021
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
Publication number
20200273772
Publication date
Aug 27, 2020
Intel Corporation
Aastha Uppal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR CONDUCTING HEAT WITH A PACKAGED DEVICE AND METHOD OF...
Publication number
20200258759
Publication date
Aug 13, 2020
Intel Corporation
Wilfred GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
Publication number
20200235051
Publication date
Jul 23, 2020
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20200227332
Publication date
Jul 16, 2020
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
Publication number
20200211969
Publication date
Jul 2, 2020
Intel Corporation
MD Altaf HOSSAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RLINK - DIE TO DIE CHANNEL INTERCONNECT CONFIGURATIONS TO IMPROVE S...
Publication number
20200066641
Publication date
Feb 27, 2020
Intel Corporation
Kemal AYGUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
Publication number
20190206792
Publication date
Jul 4, 2019
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED EMBEDDED SUBSTRATE AND SOCKET
Publication number
20190103349
Publication date
Apr 4, 2019
Intel Corporation
Ram VISWANATH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD WITH A RECESS TO ACCOMMODATE DISCRETE COMPONE...
Publication number
20180270957
Publication date
Sep 20, 2018
Intel Corporation
Rajasekaran Swaminathan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH RECESSED CONDUCTIVE CONTACTS FOR...
Publication number
20180226381
Publication date
Aug 9, 2018
Intel Corporation
KYU-OH LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
Publication number
20180007791
Publication date
Jan 4, 2018
Intel Corporation
Mani Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH RECESSED CONDUCTIVE CONTACTS FOR...
Publication number
20170207196
Publication date
Jul 20, 2017
Intel Corporation
KYU-OH LEE
H01 - BASIC ELECTRIC ELEMENTS