Ramanan V. CHEBIAM

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,569,126
- Issue date Jan 31, 2023
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization barrier structures for bonded integrated circuit inte...
- Patent number 11,532,558
- Issue date Dec 20, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of noble metals in the formation of conductive connectors
- Patent number 11,094,587
- Issue date Aug 17, 2021
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 10,832,951
- Issue date Nov 10, 2020
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 10,700,007
- Issue date Jun 30, 2020
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam healing of metal interconnects
- Patent number 10,629,525
- Issue date Apr 21, 2020
- Intel Corporation
- Ramanan V. Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming interconnects with self-assembled monolayers
- Patent number 10,553,477
- Issue date Feb 4, 2020
- Intel Corporation
- Aranzazu Maestre Caro
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Seam healing of metal interconnects
- Patent number 10,068,845
- Issue date Sep 4, 2018
- Intel Corporation
- Ramanan V. Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 9,997,457
- Issue date Jun 12, 2018
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 9,691,657
- Issue date Jun 27, 2017
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable interconnect structures with selective via posts
- Patent number 9,391,019
- Issue date Jul 12, 2016
- Intel Corporation
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with fully clad lines
- Patent number 9,385,085
- Issue date Jul 5, 2016
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 9,349,636
- Issue date May 24, 2016
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with fully clad lines
- Patent number 9,165,824
- Issue date Oct 20, 2015
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an integrated quadruple-wall capacit...
- Patent number 8,519,510
- Issue date Aug 27, 2013
- Intel Corporation
- Brian S. Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal electroless deposition of barrier layer materials
- Patent number 7,629,252
- Issue date Dec 8, 2009
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treating a liner layer to reduce surface oxides
- Patent number 7,470,617
- Issue date Dec 30, 2008
- Intel Corporation
- Ramanan Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device having increased conductiv...
- Patent number 7,372,165
- Issue date May 13, 2008
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating structure
- Patent number 7,279,231
- Issue date Oct 9, 2007
- Intel Corporation
- Ramanan V. Chebiam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for making a semiconductor device having increased conductiv...
- Patent number 7,229,922
- Issue date Jun 12, 2007
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroosmotic pump apparatus that generates low amount of hydrogen...
- Patent number 7,149,085
- Issue date Dec 12, 2006
- Intel Corporation
- Ramanan V. Chebiam
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electroless plating bath composition and method of using
- Patent number 6,908,504
- Issue date Jun 21, 2005
- Intel Corporation
- Ramanan V. Chebiam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating bath composition and method of using
- Patent number 6,645,567
- Issue date Nov 11, 2003
- Intel Corporation
- Ramanan V. Chebiam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS
- Publication number 20230197836
- Publication date Jun 22, 2023
- Intel Corporation
- Carl Hugo Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP
- Publication number 20220415818
- Publication date Dec 29, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220238451
- Publication date Jul 28, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...
- Publication number 20220199516
- Publication date Jun 23, 2022
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...
- Publication number 20210098387
- Publication date Apr 1, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20210020502
- Publication date Jan 21, 2021
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20200286836
- Publication date Sep 10, 2020
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM HEALING OF METAL INTERCONNECTS
- Publication number 20190088593
- Publication date Mar 21, 2019
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTORS HAVING A RUTHENIUM/ALUMINUM-CONTAINING LINER...
- Publication number 20190074217
- Publication date Mar 7, 2019
- Intel Corporation
- Christopher J. Jezewski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING INTERCONNECTS WITH SELF-ASSEMBLED MONOLAYERS
- Publication number 20180323101
- Publication date Nov 8, 2018
- Intel Corporation
- Aranzazu MAESTRE CARO
- B82 - NANO-TECHNOLOGY
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20180211918
- Publication date Jul 26, 2018
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS
- Publication number 20180151423
- Publication date May 31, 2018
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20170372950
- Publication date Dec 28, 2017
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DIFFUSION BARRIER BETWEEN METALS OF AN INTEGRATED CIRCUIT...
- Publication number 20170148739
- Publication date May 25, 2017
- Jeanette M. ROBERTS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM HEALING OF METAL INTERCONNECTS
- Publication number 20170084487
- Publication date Mar 23, 2017
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20160225665
- Publication date Aug 4, 2016
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH FULLY CLAD LINES
- Publication number 20160005692
- Publication date Jan 7, 2016
- Intel Corporation
- MANISH CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE INTERCONNECT STRUCTURES WITH SELECTIVE VIA POSTS
- Publication number 20150270211
- Publication date Sep 24, 2015
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20150179579
- Publication date Jun 25, 2015
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH FULLY CLAD LINES
- Publication number 20150091175
- Publication date Apr 2, 2015
- MANISH CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20150084198
- Publication date Mar 26, 2015
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN INTEGRATED QUADRUPLE-WALL CAPACIT...
- Publication number 20120326274
- Publication date Dec 27, 2012
- Brian S. Doyle
- H01 - BASIC ELECTRIC ELEMENTS

Ramanan V. CHEBIAM

Person

Patents Grantslast 30 patents

Subtractively patterned interconnect structures for integrated circ...

Interconnect structures and methods of fabrication

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Metallization barrier structures for bonded integrated circuit inte...

Subtractively patterned interconnect structures for integrated circ...

Interconnect structures and methods of fabrication

Cobalt based interconnects and methods of fabrication thereof

Use of noble metals in the formation of conductive connectors

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Seam healing of metal interconnects

Forming interconnects with self-assembled monolayers

Seam healing of metal interconnects

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Scalable interconnect structures with selective via posts

Interconnects with fully clad lines

Interconnect wires including relatively low resistivity cores

Interconnects with fully clad lines

Semiconductor structure having an integrated quadruple-wall capacit...

Conformal electroless deposition of barrier layer materials

Treating a liner layer to reduce surface oxides

Method for making a semiconductor device having increased conductiv...

Electroless plating structure

Method for making a semiconductor device having increased conductiv...

Electroosmotic pump apparatus that generates low amount of hydrogen...

Electroless plating bath composition and method of using

Electroless plating bath composition and method of using

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

SEAM HEALING OF METAL INTERCONNECTS

CONDUCTIVE CONNECTORS HAVING A RUTHENIUM/ALUMINUM-CONTAINING LINER...

FORMING INTERCONNECTS WITH SELF-ASSEMBLED MONOLAYERS

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SELECTIVE DIFFUSION BARRIER BETWEEN METALS OF AN INTEGRATED CIRCUIT...

SEAM HEALING OF METAL INTERCONNECTS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

INTERCONNECTS WITH FULLY CLAD LINES

SCALABLE INTERCONNECT STRUCTURES WITH SELECTIVE VIA POSTS

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECTS WITH FULLY CLAD LINES

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SEMICONDUCTOR STRUCTURE HAVING AN INTEGRATED QUADRUPLE-WALL CAPACIT...