Ramesh Bhandari

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board
- Patent number 8,829,355
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20150026975
- Publication date Jan 29, 2015
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20100243299
- Publication date Sep 30, 2010
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR