RAMIN EMAMI

Person

SAN JOSE, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-phase polishing pad
- Patent number 8,133,096
- Issue date Mar 13, 2012
- Applied Materials, Inc.
- Ramin Emami
- B24 - GRINDING POLISHING
Information Patent Grant
Vibration damping during chemical mechanical polishing
- Patent number 7,497,767
- Issue date Mar 3, 2009
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Vibration damping in chemical mechanical polishing system
- Patent number 7,331,847
- Issue date Feb 19, 2008
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer cleaning solution for cobalt electroless application
- Patent number 7,273,813
- Issue date Sep 25, 2007
- Applied Materials, Inc.
- Ramin Emami
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Pretreatment for electroless deposition
- Patent number 7,256,111
- Issue date Aug 14, 2007
- Applied Materials, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarized copper cleaning for reduced defects
- Patent number 7,104,267
- Issue date Sep 12, 2006
- Applied Materials Inc.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High through-put Cu CMP with significantly reduced erosion and dishing
- Patent number 7,041,599
- Issue date May 9, 2006
- Applied Materials Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Vibration damping in a chemical mechanical polishing system
- Patent number 7,014,545
- Issue date Mar 21, 2006
- Applied Materials Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Article for polishing semiconductor substrates
- Patent number 7,014,538
- Issue date Mar 21, 2006
- Applied Materials, Inc.
- James V. Tietz
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-phase polishing pad
- Patent number 6,857,941
- Issue date Feb 22, 2005
- Applied Materials, Inc.
- Ramin Emami
- B24 - GRINDING POLISHING
Information Patent Grant
Thermal preconditioning fixed abrasive articles
- Patent number 6,832,948
- Issue date Dec 21, 2004
- Applied Materials Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for edge bead removal
- Patent number 6,786,996
- Issue date Sep 7, 2004
- Applied Materials Inc.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary ring
- Patent number 6,708,701
- Issue date Mar 23, 2004
- Applied Materials Inc.
- Ramin Emami
- B08 - CLEANING
Information Patent Grant
Vibration damping in a chemical mechanical polishing system
- Patent number 6,676,497
- Issue date Jan 13, 2004
- Applied Materials Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Pad cleaning for a CMP system
- Patent number 6,669,538
- Issue date Dec 30, 2003
- Applied Materials Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Barrier layer buffing after Cu CMP
- Patent number 6,656,842
- Issue date Dec 2, 2003
- Applied Materials, Inc.
- Shijian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platen for retaining polishing material
- Patent number 6,592,439
- Issue date Jul 15, 2003
- Applied Materials, Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Planarized Cu cleaning for reduced defects
- Patent number 6,432,826
- Issue date Aug 13, 2002
- Applied Materials, Inc.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for chemical mechanical planarization
- Patent number 6,413,873
- Issue date Jul 2, 2002
- Applied Materials, Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioning fixed abrasive articles
- Patent number 6,322,427
- Issue date Nov 27, 2001
- Applied Materials, Inc.
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge scrubber and method
- Patent number 6,299,698
- Issue date Oct 9, 2001
- Applied Materials, Inc.
- Ramin Emami
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Wafer cleaning solution for cobalt electroless application
- Publication number 20060174912
- Publication date Aug 10, 2006
- Ramin Emami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Vibration damping in chemical mechanical polishing system
- Publication number 20060148387
- Publication date Jul 6, 2006
- Applied Materials, Inc., a Delaware corporation
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
Vibration damping during chemical mechanical polishing
- Publication number 20050245181
- Publication date Nov 3, 2005
- APPLIED MATERIALS, INC.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
Multi-phase polishing pad
- Publication number 20050189235
- Publication date Sep 1, 2005
- Ramin Emami
- B24 - GRINDING POLISHING
Information Patent Application
Electroless palladium nitrate activation prior to cobalt-alloy depo...
- Publication number 20050170650
- Publication date Aug 4, 2005
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless cobalt alloy deposition process
- Publication number 20050161338
- Publication date Jul 28, 2005
- APPLIED MATERIALS, INC.
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pretreatment for electroless deposition
- Publication number 20050164497
- Publication date Jul 28, 2005
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration damping in a chemical mechanical polishing system
- Publication number 20040142646
- Publication date Jul 22, 2004
- Applied Materials, Inc., a Delaware corporation
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
Fixed abrasive articles
- Publication number 20040082288
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- James V. Tietz
- B24 - GRINDING POLISHING
Information Patent Application
In-situ pre-clean for electroplating process
- Publication number 20030201185
- Publication date Oct 30, 2003
- APPLIED MATERIALS, INC.
- Rajeev Bajaj
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating solution composition control
- Publication number 20030150734
- Publication date Aug 14, 2003
- APPLIED MATERIALS, INC.
- Rajeev Bajaj
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for preventing surface corrosion in an edge bead removal pro...
- Publication number 20030073320
- Publication date Apr 17, 2003
- APPLIED MATERIALS, INC.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for edge bead removal
- Publication number 20030073309
- Publication date Apr 17, 2003
- APPLIED MATERIALS, INC.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capillary ring
- Publication number 20030070755
- Publication date Apr 17, 2003
- APPLIED MATERIALS, INC.
- Ramin Emami
- B08 - CLEANING
Information Patent Application
N2 splash guard for liquid injection on the rotating substrate
- Publication number 20030070695
- Publication date Apr 17, 2003
- APPLIED MATERIALS, INC.
- Ramin Emami
- B08 - CLEANING
Information Patent Application
Multi-phase polishing pad
- Publication number 20020197946
- Publication date Dec 26, 2002
- APPLIED MATERIALS, INC.
- Ramin Emami
- B24 - GRINDING POLISHING
Information Patent Application
Pad Cleaning for a CMP system
- Publication number 20020090896
- Publication date Jul 11, 2002
- LI,ET AL
- Shijian Li
- B24 - GRINDING POLISHING
Information Patent Application
BARRIER LAYER BUFFING AFTER CU CMP
- Publication number 20010055880
- Publication date Dec 27, 2001
- SHIJIAN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarized copper cleaning for reduced defects
- Publication number 20010015345
- Publication date Aug 23, 2001
- APPLIED MATERIALS, INC.
- Ramin Emami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High through-put copper CMP with reduced erosion and dishing
- Publication number 20010004538
- Publication date Jun 21, 2001
- APPLIED MATERIALS, INC.
- Shijian Li
- B24 - GRINDING POLISHING

RAMIN EMAMI

Person

Patents Grantslast 30 patents

Multi-phase polishing pad

Vibration damping during chemical mechanical polishing

Vibration damping in chemical mechanical polishing system

Wafer cleaning solution for cobalt electroless application

Pretreatment for electroless deposition

Planarized copper cleaning for reduced defects

High through-put Cu CMP with significantly reduced erosion and dishing

Vibration damping in a chemical mechanical polishing system

Article for polishing semiconductor substrates

Multi-phase polishing pad

Thermal preconditioning fixed abrasive articles

Apparatus and method for edge bead removal

Capillary ring

Vibration damping in a chemical mechanical polishing system

Pad cleaning for a CMP system

Barrier layer buffing after Cu CMP

Platen for retaining polishing material

Planarized Cu cleaning for reduced defects

System for chemical mechanical planarization

Conditioning fixed abrasive articles

Wafer edge scrubber and method

Patents Applicationslast 30 patents

Wafer cleaning solution for cobalt electroless application

Vibration damping in chemical mechanical polishing system

Vibration damping during chemical mechanical polishing

Multi-phase polishing pad

Electroless palladium nitrate activation prior to cobalt-alloy depo...

Electroless cobalt alloy deposition process

Pretreatment for electroless deposition

Vibration damping in a chemical mechanical polishing system

Fixed abrasive articles

In-situ pre-clean for electroplating process

Electroplating solution composition control

Method for preventing surface corrosion in an edge bead removal pro...

Apparatus and method for edge bead removal

Capillary ring

N2 splash guard for liquid injection on the rotating substrate

Multi-phase polishing pad

Pad Cleaning for a CMP system

BARRIER LAYER BUFFING AFTER CU CMP

Planarized copper cleaning for reduced defects

High through-put copper CMP with reduced erosion and dishing