Raminda Udaya Madurawe

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked-die image sensors with shielding
- Patent number 11,133,346
- Issue date Sep 28, 2021
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 10,964,705
- Issue date Mar 30, 2021
- Semiconductor Components Industries, LLC
- Irfan Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with low-voltage transistors
- Patent number 10,708,529
- Issue date Jul 7, 2020
- Semiconductor Components Industries, L.L.C.
- Raminda Madurawe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Programmable structured arrays
- Patent number 10,594,320
- Issue date Mar 17, 2020
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked-die image sensors with shielding
- Patent number 10,566,375
- Issue date Feb 18, 2020
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated-circuits
- Patent number 10,447,272
- Issue date Oct 15, 2019
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Timing exact design conversions from FPGA to ASIC
- Patent number 10,339,245
- Issue date Jul 2, 2019
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pads and pin-outs in three dimensional integrated circuits
- Patent number 10,304,854
- Issue date May 28, 2019
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-port image pixels
- Patent number 10,033,947
- Issue date Jul 24, 2018
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pads and pin-outs in three dimensional integrated circuits
- Patent number 9,978,773
- Issue date May 22, 2018
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional integrated circuits
- Patent number 9,912,336
- Issue date Mar 6, 2018
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Programmable structured arrays
- Patent number 9,882,567
- Issue date Jan 30, 2018
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bottom-gate thin-body transistors for stacked wafer integrated circ...
- Patent number 9,812,555
- Issue date Nov 7, 2017
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency image sensor pixels with deep trench isolation stru...
- Patent number 9,686,457
- Issue date Jun 20, 2017
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pads and pin-outs in three dimensional integrated circuits
- Patent number 9,679,914
- Issue date Jun 13, 2017
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Grant
Image sensor pixels with adjustable body bias
- Patent number 9,591,245
- Issue date Mar 7, 2017
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monolithically stacked image sensors
- Patent number 9,564,464
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Timing exact design conversions from FPGA to ASIC
- Patent number 9,547,736
- Issue date Jan 17, 2017
- Callahan Cellular L.L.C.
- Raminda Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Image sensor pixels with multiple compartments
- Patent number 9,524,994
- Issue date Dec 20, 2016
- Semiconductor Components Industries, LLC
- Raminda Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable structured arrays
- Patent number 9,397,665
- Issue date Jul 19, 2016
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Three dimensional integrated circuits
- Patent number 9,240,790
- Issue date Jan 19, 2016
- Callahan Cellular L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Automated metal pattern generation for integrated circuits
- Patent number 9,087,169
- Issue date Jul 21, 2015
- Raminda U. Madurawe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pads and pin-outs in three dimensional integrated circuits
- Patent number 9,070,668
- Issue date Jun 30, 2015
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional integrated circuits
- Patent number 8,856,699
- Issue date Oct 7, 2014
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Three dimensional integrated circuits
- Patent number 8,829,664
- Issue date Sep 9, 2014
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MPGA products based on a prototype FPGA
- Patent number RE45110
- Issue date Sep 2, 2014
- Raminda Udaya Madurawe
- 716 - Computer-aided design and analysis of circuits and semiconductor masks
Information Patent Grant
Programmable structured arrays
- Patent number 8,810,276
- Issue date Aug 19, 2014
- Raminda U. Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Pads and pin-outs in three dimensional integrated circuits
- Patent number 8,643,162
- Issue date Feb 4, 2014
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Grant
Timing exact design conversions from FPGA to ASIC
- Patent number 8,499,269
- Issue date Jul 30, 2013
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional integrated circuits
- Patent number 8,429,585
- Issue date Apr 23, 2013
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CAPACITOR DEVICES AND METHODS
- Publication number 20210168312
- Publication date Jun 3, 2021
- Semiconductor Components Industries, LLC
- Raminda U. MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE IMAGE SENSORS WITH SHIELDING
- Publication number 20200135795
- Publication date Apr 30, 2020
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20200083231
- Publication date Mar 12, 2020
- Semiconductor Components Industries, LLC
- Irfan RAHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20190279993
- Publication date Sep 12, 2019
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS WITH LOW-VOLTAGE TRANSISTORS
- Publication number 20190191116
- Publication date Jun 20, 2019
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20180277549
- Publication date Sep 27, 2018
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20180167071
- Publication date Jun 14, 2018
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE STRUCTURED ARRAYS
- Publication number 20180159537
- Publication date Jun 7, 2018
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20170278850
- Publication date Sep 28, 2017
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED-DIE IMAGE SENSORS WITH SHIELDING
- Publication number 20170221954
- Publication date Aug 3, 2017
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIMING EXACT DESIGN CONVERSIONS FROM FPGA TO ASIC
- Publication number 20170124241
- Publication date May 4, 2017
- CALLAHAN CELLULAR L.L.C.
- Raminda Udaya MADURAWE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-PORT IMAGE PIXELS
- Publication number 20170126993
- Publication date May 4, 2017
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH EFFICIENCY IMAGE SENSOR PIXELS WITH DEEP TRENCH ISOLATION STRU...
- Publication number 20170078539
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MONOLITHICALLY STACKED IMAGE SENSORS
- Publication number 20160358967
- Publication date Dec 8, 2016
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-GATE THIN-BODY TRANSISTORS FOR STACKED WAFER INTEGRATED CIRC...
- Publication number 20160353038
- Publication date Dec 1, 2016
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE STRUCTURED ARRAYS
- Publication number 20160308535
- Publication date Oct 20, 2016
- Yakimishu Co. Ltd. L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PIXELS WITH MULTIPLE COMPARTMENTS
- Publication number 20160307945
- Publication date Oct 20, 2016
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PIXELS WITH ADJUSTABLE BODY BIAS
- Publication number 20160307949
- Publication date Oct 20, 2016
- Semiconductor Components Industries, LLC
- Raminda MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20160134288
- Publication date May 12, 2016
- Callahan Cellular, L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20160013192
- Publication date Jan 14, 2016
- Yakimishu Co. Ltd. L.L.C.
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE STRUCTURED ARRAYS
- Publication number 20150077159
- Publication date Mar 19, 2015
- Yakimishu Co. Ltd. L.L.C.
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20140117413
- Publication date May 1, 2014
- Yakimishu Co. Ltd. L.L.C.
- Raminda Udaya Madurawe
- G11 - INFORMATION STORAGE
Information Patent Application
TIMING EXACT DESIGN CONVERSIONS FROM FPGA TO ASIC
- Publication number 20130311961
- Publication date Nov 21, 2013
- Raminda MADURAWE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20130002296
- Publication date Jan 3, 2013
- YAKIMISHU CO. LTD., LLC
- Raminda Udaya MADURAWE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE STRUCTURED ARRAYS
- Publication number 20120319728
- Publication date Dec 20, 2012
- Raminda Udaya Madurawe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED METAL PATTERN GENERATION FOR INTEGRATED CIRUCITS
- Publication number 20120286822
- Publication date Nov 15, 2012
- Raminda Udaya Madurawe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Logic for Metal Configurable Integrated Circuits
- Publication number 20120119782
- Publication date May 17, 2012
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20110102014
- Publication date May 5, 2011
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW POWER PROGRAMMABLE LOGIC DEVICES
- Publication number 20110074464
- Publication date Mar 31, 2011
- Senani Gunaratna
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PROGRAMMABLE LOGIC DEVICES COMPRISING TIME MULTIPLEXED PROGRAMMABLE...
- Publication number 20100207660
- Publication date Aug 19, 2010
- Raminda Udaya Madurawe
- H03 - BASIC ELECTRONIC CIRCUITRY

Raminda Udaya Madurawe

Person

Patents Grantslast 30 patents

Stacked-die image sensors with shielding

Method of forming a semiconductor device

Image sensors with low-voltage transistors

Programmable structured arrays

Stacked-die image sensors with shielding

Three dimensional integrated-circuits

Timing exact design conversions from FPGA to ASIC

Pads and pin-outs in three dimensional integrated circuits

Multi-port image pixels

Pads and pin-outs in three dimensional integrated circuits

Three dimensional integrated circuits

Programmable structured arrays

Bottom-gate thin-body transistors for stacked wafer integrated circ...

High efficiency image sensor pixels with deep trench isolation stru...

Pads and pin-outs in three dimensional integrated circuits

Image sensor pixels with adjustable body bias

Monolithically stacked image sensors

Timing exact design conversions from FPGA to ASIC

Image sensor pixels with multiple compartments

Programmable structured arrays

Three dimensional integrated circuits

Automated metal pattern generation for integrated circuits

Pads and pin-outs in three dimensional integrated circuits

Three dimensional integrated circuits

Three dimensional integrated circuits

MPGA products based on a prototype FPGA

Programmable structured arrays

Pads and pin-outs in three dimensional integrated circuits

Timing exact design conversions from FPGA to ASIC

Three dimensional integrated circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR CAPACITOR DEVICES AND METHODS

STACKED-DIE IMAGE SENSORS WITH SHIELDING

METHOD OF FORMING A SEMICONDUCTOR DEVICE

PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS

IMAGE SENSORS WITH LOW-VOLTAGE TRANSISTORS

PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS

THREE DIMENSIONAL INTEGRATED CIRCUITS

PROGRAMMABLE STRUCTURED ARRAYS

PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS

STACKED-DIE IMAGE SENSORS WITH SHIELDING

TIMING EXACT DESIGN CONVERSIONS FROM FPGA TO ASIC

MULTI-PORT IMAGE PIXELS

HIGH EFFICIENCY IMAGE SENSOR PIXELS WITH DEEP TRENCH ISOLATION STRU...

MONOLITHICALLY STACKED IMAGE SENSORS

BOTTOM-GATE THIN-BODY TRANSISTORS FOR STACKED WAFER INTEGRATED CIRC...

PROGRAMMABLE STRUCTURED ARRAYS

IMAGE SENSOR PIXELS WITH MULTIPLE COMPARTMENTS

IMAGE SENSOR PIXELS WITH ADJUSTABLE BODY BIAS

THREE DIMENSIONAL INTEGRATED CIRCUITS

PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS

PROGRAMMABLE STRUCTURED ARRAYS

PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS

TIMING EXACT DESIGN CONVERSIONS FROM FPGA TO ASIC

THREE DIMENSIONAL INTEGRATED CIRCUITS

PROGRAMMABLE STRUCTURED ARRAYS

AUTOMATED METAL PATTERN GENERATION FOR INTEGRATED CIRUCITS

Logic for Metal Configurable Integrated Circuits

THREE DIMENSIONAL INTEGRATED CIRCUITS

LOW POWER PROGRAMMABLE LOGIC DEVICES

PROGRAMMABLE LOGIC DEVICES COMPRISING TIME MULTIPLEXED PROGRAMMABLE...