Ramlah Binte Abdul Razak

Person

Parker, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cantilevered dies in ceramic packages
- Patent number 12,176,255
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
- Patent number 11,915,986
- Issue date Feb 27, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved contact structure
- Patent number 8,860,218
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bump heights and multiple bump...
- Patent number 8,704,371
- Issue date Apr 22, 2014
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit cable assembly for a hard disk drive
- Patent number 8,385,023
- Issue date Feb 26, 2013
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC PACKAGE CAPACITORS
- Publication number 20230343767
- Publication date Oct 26, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230274989
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED DIES IN CERAMIC PACKAGES
- Publication number 20230245935
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE BUMP HEIGHTS AND MULTIPLE BUMP...
- Publication number 20130087910
- Publication date Apr 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- RAMLAH BINTE ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT STRUCTURE
- Publication number 20130087909
- Publication date Apr 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- RAMLAH BINTE ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT CABLE ASSEMBLY FOR A HARD DISK DRIVE
- Publication number 20120281306
- Publication date Nov 8, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte Abdul Razak
- G11 - INFORMATION STORAGE

Ramlah Binte Abdul Razak

Person

Patents Grantslast 30 patents

Cantilevered dies in ceramic packages

Ceramic semiconductor device package with copper tungsten conductiv...

Semiconductor device having improved contact structure

Semiconductor device having multiple bump heights and multiple bump...

Printed circuit cable assembly for a hard disk drive

Patents Applicationslast 30 patents

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

CERAMIC PACKAGE CAPACITORS

CERAMIC SEMICONDUCTOR DEVICE PACKAGE

CANTILEVERED DIES IN CERAMIC PACKAGES

SEMICONDUCTOR DEVICE HAVING MULTIPLE BUMP HEIGHTS AND MULTIPLE BUMP...

SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT STRUCTURE

PRINTED CIRCUIT CABLE ASSEMBLY FOR A HARD DISK DRIVE