Rammil SEGUIDO

Person

City of Malolos, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,688,715
- Issue date Jun 27, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 11,552,007
- Issue date Jan 10, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,152,326
- Issue date Oct 19, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms and related methods
- Patent number 11,004,776
- Issue date May 11, 2021
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,957,634
- Issue date Mar 23, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,615,104
- Issue date Apr 7, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,109,563
- Issue date Oct 23, 2018
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms and related methods
- Patent number 9,947,612
- Issue date Apr 17, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for stacked integrated circuit dies
- Patent number 9,258,890
- Issue date Feb 9, 2016
- STMicroelectronics, Inc.
- Rammil Seguido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20220005782
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS
- Publication number 20210242112
- Publication date Aug 5, 2021
- STMICROELECTRONICS, INC.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20210183750
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20200194355
- Publication date Jun 18, 2020
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20200135686
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20190043790
- Publication date Feb 7, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS
- Publication number 20180197809
- Publication date Jul 12, 2018
- STMicroelectronics, Inc.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20180190576
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS
- Publication number 20170162479
- Publication date Jun 8, 2017
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES
- Publication number 20150351234
- Publication date Dec 3, 2015
- STMicroelectronics, Inc.
- Rammil Seguido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Rammil SEGUIDO

Person

Patents Grantslast 30 patents

Semiconductor device with frame having arms

Semiconductor die with multiple contact pads electrically coupled t...

Modified leadframe design with adhesive overflow recesses

Semiconductor die with multiple contact pads electrically coupled t...

Semiconductor device with frame having arms and related methods

Modified leadframe design with adhesive overflow recesses

Modified leadframe design with adhesive overflow recesses

Modified leadframe design with adhesive overflow recesses

Semiconductor device with frame having arms and related methods

Support structure for stacked integrated circuit dies

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...

SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS

SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES