Ramy Nashed Bassely SAID

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three dimensional memory device and method of making thereof by for...
- Patent number 12,185,540
- Issue date Dec 31, 2024
- SanDisk Technologies LLC
- Michiaki Sano
Information Patent Grant
Three-dimensional memory device including an isolation-trench etch...
- Patent number 12,160,989
- Issue date Dec 3, 2024
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including mixed oxide charge trapping materials and m...
- Patent number 12,150,302
- Issue date Nov 19, 2024
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
Information Patent Grant
Three dimensional memory device and method of making thereof by for...
- Patent number 12,101,936
- Issue date Sep 24, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
Information Patent Grant
Three-dimensional memory device including discrete charge storage e...
- Patent number 11,968,834
- Issue date Apr 23, 2024
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
Information Patent Grant
Three-dimensional memory device with metal-barrier-metal word lines...
- Patent number 11,968,826
- Issue date Apr 23, 2024
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
Information Patent Grant
Three-dimensional memory device including discrete charge storage e...
- Patent number 11,749,736
- Issue date Sep 5, 2023
- SanDisk Technologies LLC
- Xue Bai Pitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing low dielectric constant bonding dielectr...
- Patent number 11,646,283
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array including dual work function floatin...
- Patent number 11,631,686
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,515,273
- Issue date Nov 29, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional semiconductor device containing composite contact...
- Patent number 11,515,250
- Issue date Nov 29, 2022
- SanDisk Technologies LLC
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including multi-bit charge storage...
- Patent number 11,482,531
- Issue date Oct 25, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multibit ferroelectric memory cells and methods for forming the same
- Patent number 11,450,687
- Issue date Sep 20, 2022
- SanDisk Technologies LLC
- Roshan Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including having metal organic framework inter...
- Patent number 11,430,736
- Issue date Aug 30, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing metal-organic framework...
- Patent number 11,387,250
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing metal-organic framework inter-line...
- Patent number 11,296,028
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing metal-organic framework bonding dielectr...
- Patent number 11,171,097
- Issue date Nov 9, 2021
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-VOLATILE MEMORY WITH SUB-PLANES HAVING INDIVIDUALLY BIASABLE SO...
- Publication number 20240105262
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely Said
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105622
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105623
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AN ISOLATION-TRENCH ETCH...
- Publication number 20230328973
- Publication date Oct 12, 2023
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MIXED OXIDE CHARGE TRAPPING MATERIALS AND M...
- Publication number 20230269939
- Publication date Aug 24, 2023
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AIRGAP CONTAINING INSULAT...
- Publication number 20230018394
- Publication date Jan 19, 2023
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352201
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352200
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Michiaki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH METAL-BARRIER-METAL WORD LINES...
- Publication number 20220352193
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352199
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Yusuke MUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...
- Publication number 20220285386
- Publication date Sep 8, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...
- Publication number 20220278216
- Publication date Sep 1, 2022
- SANDISK TECHNOLOGIES LLC
- Xue Bai PITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-BIT CHARGE STORAGE...
- Publication number 20220254797
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY INCLUDING DUAL WORK FUNCTION FLOATIN...
- Publication number 20220254798
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR DEVICE CONTAINING COMPOSITE CONTACT...
- Publication number 20220246517
- Publication date Aug 4, 2022
- SANDISK TECHNOLOGIES LLC
- Monica TITUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIBIT FERROELECTRIC MEMORY CELLS AND METHODS FOR FORMING THE SAME
- Publication number 20220189993
- Publication date Jun 16, 2022
- SANDISK TECHNOLOGIES LLC
- Roshan TIRUKKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING FERROELECTRIC-ASSISTED M...
- Publication number 20220139960
- Publication date May 5, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...
- Publication number 20220093644
- Publication date Mar 24, 2022
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HAVING METAL ORGANIC FRAMEWORK INTER...
- Publication number 20220059462
- Publication date Feb 24, 2022
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...
- Publication number 20210327838
- Publication date Oct 21, 2021
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING BONDING PADS SPACED APART BY POLYMER MAT...
- Publication number 20210320075
- Publication date Oct 14, 2021
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING DIELECTR...
- Publication number 20210233881
- Publication date Jul 29, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONTAINING METAL-ORGANIC FRAMEWORK INTER-LINE...
- Publication number 20210193585
- Publication date Jun 24, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING METAL-ORGANIC FRAMEWORK...
- Publication number 20210193674
- Publication date Jun 24, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...
- Publication number 20210028135
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...
- Publication number 20210028136
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS

Ramy Nashed Bassely SAID

Person

Patents Grantslast 30 patents

Three dimensional memory device and method of making thereof by for...

Three-dimensional memory device including an isolation-trench etch...

Memory device including mixed oxide charge trapping materials and m...

Three dimensional memory device and method of making thereof by for...

Three-dimensional memory device including discrete charge storage e...

Three-dimensional memory device with metal-barrier-metal word lines...

Three-dimensional memory device including discrete charge storage e...

Bonded assembly containing low dielectric constant bonding dielectr...

Three-dimensional memory array including dual work function floatin...

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Three dimensional semiconductor device containing composite contact...

Three-dimensional memory device including multi-bit charge storage...

Multibit ferroelectric memory cells and methods for forming the same

Semiconductor device including having metal organic framework inter...

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Three-dimensional memory device containing metal-organic framework...

Semiconductor device containing metal-organic framework inter-line...

Bonded assembly containing metal-organic framework bonding dielectr...

Patents Applicationslast 30 patents

NON-VOLATILE MEMORY WITH SUB-PLANES HAVING INDIVIDUALLY BIASABLE SO...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AN ISOLATION-TRENCH ETCH...

MEMORY DEVICE INCLUDING MIXED OXIDE CHARGE TRAPPING MATERIALS AND M...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AIRGAP CONTAINING INSULAT...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE-DIMENSIONAL MEMORY DEVICE WITH METAL-BARRIER-METAL WORD LINES...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-BIT CHARGE STORAGE...

THREE-DIMENSIONAL MEMORY ARRAY INCLUDING DUAL WORK FUNCTION FLOATIN...

THREE DIMENSIONAL SEMICONDUCTOR DEVICE CONTAINING COMPOSITE CONTACT...

MULTIBIT FERROELECTRIC MEMORY CELLS AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING FERROELECTRIC-ASSISTED M...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE E...

SEMICONDUCTOR DEVICE INCLUDING HAVING METAL ORGANIC FRAMEWORK INTER...

BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...

BONDED ASSEMBLY CONTAINING BONDING PADS SPACED APART BY POLYMER MAT...

BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING DIELECTR...

SEMICONDUCTOR DEVICE CONTAINING METAL-ORGANIC FRAMEWORK INTER-LINE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING METAL-ORGANIC FRAMEWORK...

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...