Ran Fu

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Kwai Chung, CN

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe comprising tin plating or an intermetallic layer formed t...
- Patent number 7,462,926
- Issue date Dec 9, 2008
- ASM Assembly Automation Ltd.
- Ran Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding tool
- Patent number 7,458,495
- Issue date Dec 2, 2008
- ASM Assembly Automation LTD
- Ran Fu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire clamping plate
- Patent number 7,246,735
- Issue date Jul 24, 2007
- ASM Assembly Automation Ltd.
- Deming Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Leadframe comprising tin plating or an intermetallic layer formed t...
- Publication number 20070126096
- Publication date Jun 7, 2007
- ASM Assembly Automation Ltd
- Ran Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CLAMPING PLATE
- Publication number 20060151571
- Publication date Jul 13, 2006
- ASM Assembly Automation Ltd
- Deming Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip bonding tool
- Publication number 20060076391
- Publication date Apr 13, 2006
- ASM Assembly Automation Ltd.
- Ran Fu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR