Ran Jiang

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and power amplifier
- Patent number 12,341,480
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Xiaomin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTUR...
- Publication number 20240213203
- Publication date Jun 27, 2024
- Huawei Technologies Co., Ltd
- Yonggang ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Power Amplifier
- Publication number 20220131510
- Publication date Apr 28, 2022
- Huawei Technologies Co., Ltd
- Xiaomin Zhang
- H01 - BASIC ELECTRIC ELEMENTS