Ran Shi WANG

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding process incorporating infrared vision system
- Patent number 8,633,441
- Issue date Jan 21, 2014
- ASM Assembly Automation LTD
- Ran Shi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING PROCESS INCORPORATING INFRARED VISION SYSTEM
- Publication number 20110051124
- Publication date Mar 3, 2011
- Ran Shi WANG
- H01 - BASIC ELECTRIC ELEMENTS