Ranadeep Dutta

Person

Del Mar, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal bridge interposer structure
- Patent number 12,046,530
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave (SAW) filter packages employing an enhanced t...
- Patent number 11,984,874
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
ESL-less AC resistor for high frequency applications
- Patent number 11,862,367
- Issue date Jan 2, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked filters with a shared substrate cap
- Patent number 11,689,181
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device with electromagnetic shield
- Patent number 11,652,064
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked inductor having a discrete metal-stack pattern
- Patent number 11,626,236
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with passive elements for...
- Patent number 11,605,620
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heterogeneous integrated wideband high electron mobility transistor...
- Patent number 11,437,367
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced integrated passive device (IPD) with thin-film heat spread...
- Patent number 11,404,345
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator device
- Patent number 11,394,360
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuits of III-V devices over silicon with high quality in...
- Patent number 11,393,789
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metamorphic high electron mobility transistor-heterojunction bipola...
- Patent number 11,380,678
- Issue date Jul 5, 2022
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned collector heterojunction bipolar transistor (HBT)
- Patent number 11,355,617
- Issue date Jun 7, 2022
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with 3D inductor and magnetic core in substrate
- Patent number 11,336,251
- Issue date May 17, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer hybrid bonding with forming glass
- Patent number 11,152,272
- Issue date Oct 19, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic self-aligned heterojunction bipolar transistor (HBT) and...
- Patent number 11,024,728
- Issue date Jun 1, 2021
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned high voltage transistor
- Patent number 10,950,721
- Issue date Mar 16, 2021
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge (ESD) robust transistor
- Patent number 10,748,891
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with lightly doped drain (LDD) compensation implant
- Patent number 10,707,352
- Issue date Jul 7, 2020
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor devices and method of fabricating the same
- Patent number 10,546,852
- Issue date Jan 28, 2020
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode radio frequency (RF) power amplifier on single diffusion
- Patent number 10,340,289
- Issue date Jul 2, 2019
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
CMOS and bipolar device integration including a tunable capacitor
- Patent number 10,158,030
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods and apparatuses for forming multiple radio frequency (RF) c...
- Patent number 9,252,147
- Issue date Feb 2, 2016
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage MOS transistor
- Patent number 9,153,691
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Ranadeep Dutta
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...
- Publication number 20240421790
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...
- Publication number 20240347913
- Publication date Oct 17, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY-EMBEDDED TUNABLE FILTER
- Publication number 20240243036
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Parasitic Capacitance
- Publication number 20240097619
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
- Publication number 20240096817
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS
- Publication number 20240021353
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER
- Publication number 20230275004
- Publication date Aug 31, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20230268637
- Publication date Aug 24, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BRIDGE INTERPOSER STRUCTURE
- Publication number 20230197554
- Publication date Jun 22, 2023
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESL-LESS AC RESISTOR FOR HIGH FREQUENCY APPLICATIONS
- Publication number 20230187106
- Publication date Jun 15, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...
- Publication number 20230088569
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SILICON BASED CAPACITOR
- Publication number 20230092429
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE (SAW) FILTER PACKAGES EMPLOYING AN ENHANCED T...
- Publication number 20230054636
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D INDUCTOR DESIGN USING BUNDLE SUBSTRATE VIAS
- Publication number 20220406882
- Publication date Dec 22, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT END (RFFE) HETERO-INTEGRATION
- Publication number 20220352359
- Publication date Nov 3, 2022
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND SEMICONDUCTOR AND COMPLEMENTARY METAL OXIDE SEMICONDUCTOR...
- Publication number 20220302107
- Publication date Sep 22, 2022
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INDUCTOR HAVING A DISCRETE METAL-STACK PATTERN
- Publication number 20220285080
- Publication date Sep 8, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE (SAW) DEVICES WITH A DIAMOND BRIDGE ENCLOSED...
- Publication number 20220231660
- Publication date Jul 21, 2022
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE...
- Publication number 20220069797
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH PASSIVE ELEMENTS FOR...
- Publication number 20210398957
- Publication date Dec 23, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTEGRATED PASSIVE DEVICE (IPD) WITH THIN-FILM HEAT SPREAD...
- Publication number 20210391234
- Publication date Dec 16, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAMORPHIC HIGH ELECTRON MOBILITY TRANSISTOR-HETEROJUNCTION BIPOLA...
- Publication number 20210391321
- Publication date Dec 16, 2021
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP
- Publication number 20210376810
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATED WIDEBAND HIGH ELECTRON MOBILITY TRANSISTOR...
- Publication number 20210327873
- Publication date Oct 21, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED DEVICE WITH ELECTROMAGNETIC SHIELD
- Publication number 20210175181
- Publication date Jun 10, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR DEVICE
- Publication number 20210159873
- Publication date May 27, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF HETEROGENEOUS TRANSISTORS ON DIAMOND SUBSTRATE BY LA...
- Publication number 20210151428
- Publication date May 20, 2021
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER HYBRID BONDING WITH FORMING GLASS
- Publication number 20210143071
- Publication date May 13, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ON DIAMOND THERMAL AND SHIELDING MITIGATION
- Publication number 20210104447
- Publication date Apr 8, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS

Ranadeep Dutta

Person

Patents Grantslast 30 patents

Thermal bridge interposer structure

Surface acoustic wave (SAW) filter packages employing an enhanced t...

ESL-less AC resistor for high frequency applications

Device on ceramic substrate

Radio frequency front end (RFFE) hetero-integration

Package comprising stacked filters with a shared substrate cap

Integrated device with electromagnetic shield

Stacked inductor having a discrete metal-stack pattern

Three-dimensional (3D) integrated circuit with passive elements for...

Heterogeneous integrated wideband high electron mobility transistor...

Advanced integrated passive device (IPD) with thin-film heat spread...

Resonator device

Stacked circuits of III-V devices over silicon with high quality in...

Metamorphic high electron mobility transistor-heterojunction bipola...

Self-aligned collector heterojunction bipolar transistor (HBT)

Device with 3D inductor and magnetic core in substrate

Die-to-wafer hybrid bonding with forming glass

Monolithic self-aligned heterojunction bipolar transistor (HBT) and...

Self-aligned high voltage transistor

Electrostatic discharge (ESD) robust transistor

Transistor with lightly doped drain (LDD) compensation implant

Integrated semiconductor devices and method of fabricating the same

Cascode radio frequency (RF) power amplifier on single diffusion

CMOS and bipolar device integration including a tunable capacitor

Methods and apparatuses for forming multiple radio frequency (RF) c...

High voltage MOS transistor

Patents Applicationslast 30 patents

DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...

ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...

CAVITY-EMBEDDED TUNABLE FILTER

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

Reducing Parasitic Capacitance

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...

THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS

CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

THERMAL BRIDGE INTERPOSER STRUCTURE

ESL-LESS AC RESISTOR FOR HIGH FREQUENCY APPLICATIONS

RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...

HIGH DENSITY SILICON BASED CAPACITOR

SURFACE ACOUSTIC WAVE (SAW) FILTER PACKAGES EMPLOYING AN ENHANCED T...

3D INDUCTOR DESIGN USING BUNDLE SUBSTRATE VIAS

RADIO FREQUENCY FRONT END (RFFE) HETERO-INTEGRATION

COMPOUND SEMICONDUCTOR AND COMPLEMENTARY METAL OXIDE SEMICONDUCTOR...

STACKED INDUCTOR HAVING A DISCRETE METAL-STACK PATTERN

SURFACE ACOUSTIC WAVE (SAW) DEVICES WITH A DIAMOND BRIDGE ENCLOSED...

SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH PASSIVE ELEMENTS FOR...

ADVANCED INTEGRATED PASSIVE DEVICE (IPD) WITH THIN-FILM HEAT SPREAD...

METAMORPHIC HIGH ELECTRON MOBILITY TRANSISTOR-HETEROJUNCTION BIPOLA...

PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP

HETEROGENEOUS INTEGRATED WIDEBAND HIGH ELECTRON MOBILITY TRANSISTOR...

INTEGRATED DEVICE WITH ELECTROMAGNETIC SHIELD

RESONATOR DEVICE

INTEGRATION OF HETEROGENEOUS TRANSISTORS ON DIAMOND SUBSTRATE BY LA...

DIE-TO-WAFER HYBRID BONDING WITH FORMING GLASS

SILICON ON DIAMOND THERMAL AND SHIELDING MITIGATION