Randall J. Stutzman

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,914,535
- Issue date Feb 9, 2021
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,461,018
- Issue date Oct 29, 2019
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multi-chamber heat exchanger
- Patent number 10,371,462
- Issue date Aug 6, 2019
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient heat transfer from conduction-cooled circuit cards
- Patent number 9,357,670
- Issue date May 31, 2016
- Lockheed Martin Corporation
- Randall J. Stutzman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow through cooling assemblies for conduction-cooled circuit modules
- Patent number 7,324,336
- Issue date Jan 29, 2008
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 7,186,590
- Issue date Mar 6, 2007
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,949,415
- Issue date Sep 27, 2005
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for convection cooling in horizontal applications
- Patent number 6,883,593
- Issue date Apr 26, 2005
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-relieving heatsink structure and method of attachment to an...
- Patent number 6,830,960
- Issue date Dec 14, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package with heat spreader allowing multiple heat sink at...
- Patent number 6,829,144
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Randall J. Stutzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for multi-processor shared-memory system
- Patent number 6,793,123
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,744,132
- Issue date Jun 1, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for convection cooling in horizontal applications
- Patent number 6,691,769
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platen for use in laminating press
- Patent number 6,675,852
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Varaprasad Venkata Calmidi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 6,665,187
- Issue date Dec 16, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface for an electronic module
- Patent number 6,665,186
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Varaprasad V. Calmidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a high performance chip
- Patent number 6,655,020
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,264
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,266
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for multi-processor shared-memory system
- Patent number 6,541,847
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-relieving heatsink structure and method of attachment to an...
- Patent number 6,455,924
- Issue date Sep 24, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal/electrical break for printed circuit boards
- Patent number 6,235,994
- Issue date May 22, 2001
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced heat-dissipating printed circuit board package
- Patent number 6,212,076
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Stephen W. MacQuarrie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature conduction module for a cryogenically-cooled processor
- Patent number 5,251,095
- Issue date Oct 5, 1993
- International Business Machines Corporation
- William C. Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly with enhanced heat sinking
- Patent number 5,003,429
- Issue date Mar 26, 1991
- International Business Machines Corporation
- Don L. Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20180043480
- Publication date Feb 15, 2018
- Lockheed Martin Corporation
- David L. Vos
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20180043481
- Publication date Feb 15, 2018
- Lockheed Martin Corporation
- David L. Vos
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
- Publication number 20170082371
- Publication date Mar 23, 2017
- Lockheed Martin Corporation
- David L. Vos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT HEAT TRANSFER FROM CONDUCTION-COOLED CIRCUIT CARDS
- Publication number 20150237763
- Publication date Aug 20, 2015
- Lockheed Martin Corporation
- Randall J. Stutzman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flow through cooling assemblies for conduction-cooled circuit modules
- Publication number 20070070601
- Publication date Mar 29, 2007
- Lockheed Martin Corporation
- David L. Vos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with adhesively attached heat sink
- Publication number 20040164401
- Publication date Aug 26, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink for convection cooling in horizontal applications
- Publication number 20040149423
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced lid for multichip modules
- Publication number 20040057214
- Publication date Mar 25, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging for multi-processor shared-memory system
- Publication number 20030146268
- Publication date Aug 7, 2003
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with adhesively attached heat sink
- Publication number 20030141586
- Publication date Jul 31, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink for convection cooling in horizontal applications
- Publication number 20030029601
- Publication date Feb 13, 2003
- International Business Machines Corporation
- Eric Arthur Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-relieving heatsink structure and method of attachment to an...
- Publication number 20030001248
- Publication date Jan 2, 2003
- Internationl Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platen for use in laminating press and method of lamination
- Publication number 20020189755
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Varaprasad Venkata Calmidi
- B30 - PRESSES
Information Patent Application
STRESS-RELIEVING HEATSINK STRUCTURE AND METHOD OF ATTACHMENT TO AN...
- Publication number 20020135052
- Publication date Sep 26, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE CHIP PACKAGING AND METHOD
- Publication number 20020053449
- Publication date May 9, 2002
- TIMOTHY F. CARDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip packaging and method
- Publication number 20010009196
- Publication date Jul 26, 2001
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip packaging and method
- Publication number 20010009197
- Publication date Jul 26, 2001
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS

Randall J. Stutzman

Person

Patents Grantslast 30 patents

Integrated multi-chamber heat exchanger

Integrated multi-chamber heat exchanger

Integrated multi-chamber heat exchanger

Efficient heat transfer from conduction-cooled circuit cards

Flow through cooling assemblies for conduction-cooled circuit modules

Thermally enhanced lid for multichip modules

Module with adhesively attached heat sink

Heat sink for convection cooling in horizontal applications

Stress-relieving heatsink structure and method of attachment to an...

Flip chip package with heat spreader allowing multiple heat sink at...

Packaging for multi-processor shared-memory system

Module with adhesively attached heat sink

EMI shielding for semiconductor chip carriers

Heat sink for convection cooling in horizontal applications

Platen for use in laminating press

Thermally enhanced lid for multichip modules

Liquid metal thermal interface for an electronic module

Method of packaging a high performance chip

High performance chip packaging and method

High performance chip packaging and method

Packaging for multi-processor shared-memory system

Stress-relieving heatsink structure and method of attachment to an...

Thermal/electrical break for printed circuit boards

Enhanced heat-dissipating printed circuit board package

Low temperature conduction module for a cryogenically-cooled processor

Electronic assembly with enhanced heat sinking

Patents Applicationslast 30 patents

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

INTEGRATED MULTI-CHAMBER HEAT EXCHANGER

EFFICIENT HEAT TRANSFER FROM CONDUCTION-COOLED CIRCUIT CARDS

Flow through cooling assemblies for conduction-cooled circuit modules

Module with adhesively attached heat sink

Heat sink for convection cooling in horizontal applications

Thermally enhanced lid for multichip modules

Packaging for multi-processor shared-memory system

Module with adhesively attached heat sink

Heat sink for convection cooling in horizontal applications

EMI shielding for semiconductor chip carriers

Stress-relieving heatsink structure and method of attachment to an...

Platen for use in laminating press and method of lamination

STRESS-RELIEVING HEATSINK STRUCTURE AND METHOD OF ATTACHMENT TO AN...

HIGH PERFORMANCE CHIP PACKAGING AND METHOD

High performance chip packaging and method

High performance chip packaging and method