Randy Bindrup

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Tabucco Canyon, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,741,680
- Issue date Aug 22, 2017
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,431,275
- Issue date Aug 30, 2016
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-tamper wrapper interconnect method and a device
- Patent number 8,637,985
- Issue date Jan 28, 2014
- ISC8 Inc.
- Randy Bindrup
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a neo-layer using stud bumped bare die
- Patent number 8,609,473
- Issue date Dec 17, 2013
- ISC8 Inc.
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Small Footprint Chip-Scale Package and a D...
- Publication number 20120211886
- Publication date Aug 23, 2012
- ISC8 Inc.
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anti-Tamper Wrapper Interconnect Method and a Device
- Publication number 20120205801
- Publication date Aug 16, 2012
- Randy Bindrup
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Bond Through-Via Structure and Method
- Publication number 20120068333
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
- Publication number 20120068336
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Control of Solder Collapse in Stacked Microelectronic St...
- Publication number 20120069528
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Randy Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal management device comprising thermally conductive heat spre...
- Publication number 20110085304
- Publication date Apr 14, 2011
- Irvine Sensors Corporation
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS