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Ranjan RAJOO

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Patents Grantslast 30 patents

  • Information Patent Grant

    Shielding elements for packages of semiconductor devices
    • Patent number 11,658,128
    • Issue date May 23, 2023
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ranjan Rajoo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Crackstop structures
    • Patent number 11,652,069
    • Issue date May 16, 2023
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ranjan Rajoo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding structures of semiconductor devices
    • Patent number 11,444,045
    • Issue date Sep 13, 2022
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ramasamy Chockalingam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bond pads of semiconductor devices
    • Patent number 11,244,915
    • Issue date Feb 8, 2022
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ramasamy Chockalingam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer stack protection seal
    • Patent number 9,768,089
    • Issue date Sep 19, 2017
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ranjan Rajoo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Edge structure for backgrinding asymmetrical bonded wafer
    • Patent number 9,761,561
    • Issue date Sep 12, 2017
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ranjan Rajoo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer stack protection seal
    • Patent number 9,406,577
    • Issue date Aug 2, 2016
    • GLOBALFOUNDRIES Singapore Pte. Ltd.
    • Ranjan Rajoo
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Method and device to elongate a solder joint
    • Patent number 7,178,711
    • Issue date Feb 20, 2007
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer level super stretch solder
    • Patent number 6,890,795
    • Issue date May 10, 2005
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT
    • Publication number 20240178165
    • Publication date May 30, 2024
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • Ranjan RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CRACKSTOP STRUCTURES
    • Publication number 20230238336
    • Publication date Jul 27, 2023
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • Ranjan RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELDING ELEMENTS FOR PACKAGES OF SEMICONDUCTOR DEVICES
    • Publication number 20230056509
    • Publication date Feb 23, 2023
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • RANJAN RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CRACKSTOP STRUCTURES
    • Publication number 20220181271
    • Publication date Jun 9, 2022
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • Ranjan RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
    • Publication number 20220052000
    • Publication date Feb 17, 2022
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • RAMASAMY CHOCKALINGAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOND PADS OF SEMICONDUCTOR DEVICES
    • Publication number 20210134742
    • Publication date May 6, 2021
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • RAMASAMY CHOCKALINGAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER STACK PROTECTION SEAL
    • Publication number 20160343629
    • Publication date Nov 24, 2016
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • Ranjan RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EDGE STRUCTURE FOR BACKGRINDING ASYMMETRICAL BONDED WAFER
    • Publication number 20160276310
    • Publication date Sep 22, 2016
    • GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    • Ranjan RAJOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER STACK PROTECTION SEAL
    • Publication number 20140264762
    • Publication date Sep 18, 2014
    • GLOBAL FOUNDRIES SINGAPORE PTE LTD.
    • Ranjan RAJOO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Stack Arrangement
    • Publication number 20130328209
    • Publication date Dec 12, 2013
    • Agency for Science, Technology and Research
    • Cheryl Sharmani Selvanayagam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING AND RELEASING INTERCONNECTS
    • Publication number 20090091025
    • Publication date Apr 9, 2009
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bend testing apparatus and method of carrying out the same
    • Publication number 20070256503
    • Publication date Nov 8, 2007
    • Agency For Science, Technology and Research
    • Ee Hua Wong
    • G01 - MEASURING TESTING
  • Information Patent Application

    Method and device to elongate a solder joint
    • Publication number 20070114266
    • Publication date May 24, 2007
    • Agency For Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and device to elongate a solder joint
    • Publication number 20050056684
    • Publication date Mar 17, 2005
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR