Raphael Hellwig

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Circuit arrangement with a thermal interface
- Patent number 12,107,026
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Raphael Hellwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with metal substrate
- Patent number 12,002,724
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with metal substrate
- Patent number 11,404,336
- Issue date Aug 2, 2022
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Module With Metal Substrate
- Publication number 20220310465
- Publication date Sep 29, 2022
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT WITH A THERMAL INTERFACE
- Publication number 20220199481
- Publication date Jun 23, 2022
- INFINEON TECHNOLOGIES AG
- Raphael HELLWIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Metal Substrate
- Publication number 20210407873
- Publication date Dec 30, 2021
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS