Ratibor Radojcic

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom package with metal post interconnections
- Patent number 10,971,476
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate block for PoP package
- Patent number 9,881,859
- Issue date Jan 30, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via (TSV) crack sensors for detecting TSV cracks in...
- Patent number 9,869,713
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package comprising electrostatic discharge...
- Patent number 9,853,446
- Issue date Dec 26, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated device comprising a capacitor that includes multiple pin...
- Patent number 9,704,796
- Issue date Jul 11, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising flexible connector between integrated...
- Patent number 9,633,977
- Issue date Apr 25, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising high density interconnects in inorgani...
- Patent number 9,418,877
- Issue date Aug 16, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for characterizing thermal marginality in an i...
- Patent number 9,285,418
- Issue date Mar 15, 2016
- QUALCOMM Incorporated
- Tapan J Chakraborty
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced package thermal management using external and internal cap...
- Patent number 9,136,202
- Issue date Sep 15, 2015
- QUALCOMM Incorporated
- Victor A. Chiriac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package construction with wire bond and through silicon vias
- Patent number 8,803,305
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Ratibor Radojcic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage switchable dielectric for die-level electrostatic discharge...
- Patent number 8,691,707
- Issue date Apr 8, 2014
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage switchable dielectric for die-level electrostatic discharge...
- Patent number 8,633,562
- Issue date Jan 21, 2014
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable feature interface that induces a balanced stress to preven...
- Patent number 8,076,762
- Issue date Dec 13, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designing an integrated circuit to improve yield using a variant de...
- Patent number 7,487,474
- Issue date Feb 3, 2009
- PDF Solutions, Inc.
- Dennis Ciplickas
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...
- Publication number 20170063079
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ANCHORING CONDUCTIVE MATERIAL IN SEMICONDUCTOR DEVICES
- Publication number 20170005160
- Publication date Jan 5, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...
- Publication number 20160258996
- Publication date Sep 8, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INCORPORATED INDUCTANCE ELEMENT
- Publication number 20160133614
- Publication date May 12, 2016
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BLOCK FOR PoP PACKAGE
- Publication number 20150325509
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...
- Publication number 20150318262
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS
- Publication number 20150235991
- Publication date Aug 20, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/O...
- Publication number 20150214127
- Publication date Jul 30, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER
- Publication number 20140306349
- Publication date Oct 16, 2014
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...
- Publication number 20140225246
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE SWITCHABLE DIELECTRIC FOR DIE-LEVEL ELECTROSTATIC DISCHARGE...
- Publication number 20130316526
- Publication date Nov 28, 2013
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAP...
- Publication number 20130270721
- Publication date Oct 17, 2013
- QUALCOMM Incorporated
- Victor A. Chiriac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Switchable Dielectric for Die-Level Electrostatic Discharge...
- Publication number 20120248582
- Publication date Oct 4, 2012
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Package Construction With Wire Bond And Through Silicon Vias
- Publication number 20110115064
- Publication date May 19, 2011
- QUALCOMM Incorporated
- Ratibor Radojcic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable Feature Interface That Induces A Balanced Stress To Preven...
- Publication number 20110037156
- Publication date Feb 17, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Yield improvement
- Publication number 20060101355
- Publication date May 11, 2006
- PDF Solutions, Inc.
- Dennis Ciplickas
- G06 - COMPUTING CALCULATING COUNTING

Ratibor Radojcic

Person

Patents Grantslast 30 patents

Bottom package with metal post interconnections

Substrate block for PoP package

Through-silicon via (TSV) crack sensors for detecting TSV cracks in...

Integrated circuit (IC) package comprising electrostatic discharge...

Integrated device comprising a capacitor that includes multiple pin...

Integrated device comprising flexible connector between integrated...

Integrated device comprising high density interconnects in inorgani...

Method and apparatus for characterizing thermal marginality in an i...

Enhanced package thermal management using external and internal cap...

Hybrid package construction with wire bond and through silicon vias

Voltage switchable dielectric for die-level electrostatic discharge...

Voltage switchable dielectric for die-level electrostatic discharge...

Variable feature interface that induces a balanced stress to preven...

Designing an integrated circuit to improve yield using a variant de...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...

ANCHORING CONDUCTIVE MATERIAL IN SEMICONDUCTOR DEVICES

THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...

SEMICONDUCTOR PACKAGE WITH INCORPORATED INDUCTANCE ELEMENT

SUBSTRATE BLOCK FOR PoP PACKAGE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...

BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS

INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/O...

LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER

DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...

VOLTAGE SWITCHABLE DIELECTRIC FOR DIE-LEVEL ELECTROSTATIC DISCHARGE...

ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAP...

Voltage Switchable Dielectric for Die-Level Electrostatic Discharge...

Hybrid Package Construction With Wire Bond And Through Silicon Vias

Variable Feature Interface That Induces A Balanced Stress To Preven...

Yield improvement