Ratndeep SRIVASTAVA

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for providing vias
- Patent number 8,999,184
- Issue date Apr 7, 2015
- Lam Research Corporation
- Ming-Shu Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE ETCHING AND DEPOSITION OF MEMORY LAYERS TO PROVIDE CAPACI...
- Publication number 20230320062
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Ratndeep SRIVASTAVA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROVIDING VIAS
- Publication number 20140038419
- Publication date Feb 6, 2014
- LAM RESEARCH CORPORATION
- Ming-Shu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING FEATURES WITH PLASMA PRE-ETCH TREA...
- Publication number 20130267097
- Publication date Oct 10, 2013
- LAM RESEARCH CORPORATION
- Ratndeep SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS