Ravi K. Bonam

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Secure fingerprinting of a trusted photomask
- Patent number 12,086,528
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Scott David Halle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package structure with offset stacked chips and top and...
- Patent number 11,887,908
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determination of optical roughness in EUV structures
- Patent number 11,619,877
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determination of optical roughness in EUV structures
- Patent number 11,480,868
- Issue date Oct 25, 2022
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microelectronic package with embedded cooling cha...
- Patent number 11,462,512
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu—Cu bonding for interconnects on bridge chip attached to chips an...
- Patent number 11,239,167
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-fluidic channels having various critical dimensions
- Patent number 11,081,424
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor wafer having trenches with varied dimensions for mult...
- Patent number 11,049,844
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip bridge connector
- Patent number 10,991,635
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Dale Curtis McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
- Patent number 10,943,883
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microelectronic package with embedded cooling cha...
- Patent number 10,937,764
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask process aware calibration using mask pattern fidelity inspections
- Patent number 10,725,454
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Ravi K. Bonam
- G05 - CONTROLLING REGULATING
Information Patent Grant
Care area generation by detection optimized methodology
- Patent number 10,437,951
- Issue date Oct 8, 2019
- International Business Machines Corporation
- Ravi K. Bonam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resist having tuned interface hardmask layer for EUV exposure
- Patent number 10,141,188
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Michael P Belyansky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist having tuned interface hardmask layer for EUV exposure
- Patent number 10,134,592
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Michael P Belyansky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist having tuned interface hardmask layer for EUV exposure
- Patent number 9,929,012
- Issue date Mar 27, 2018
- International Business Machines Corporation
- Michael P Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photoemission sources and scalable photoemission structures
- Patent number 9,881,762
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photoemission sources and scalable photoemission structures
- Patent number 9,263,228
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating three-dimensional nano-scale structures and...
- Patent number 9,177,817
- Issue date Nov 3, 2015
- The Research Foundation for the State University of New York
- John G. Hartley
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Structure With Offset Stacked Chips And Top And...
- Publication number 20230197552
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE FINGERPRINTING OF A TRUSTED PHOTOMASK
- Publication number 20230116390
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Scott David HALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DETERMINATION OF OPTICAL ROUGHNESS IN EUV STRUCTURES
- Publication number 20220357648
- Publication date Nov 10, 2022
- International Business Machines Corporation
- RAVI K. BONAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...
- Publication number 20210175174
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...
- Publication number 20210118854
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...
- Publication number 20210091032
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP BRIDGE CONNECTOR
- Publication number 20210020529
- Publication date Jan 21, 2021
- International Business Machines Corporation
- Dale Curtis McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...
- Publication number 20210005573
- Publication date Jan 7, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-FLUIDIC CHANNELS HAVING VARIOUS CRITICAL DIMENSIONS
- Publication number 20200402889
- Publication date Dec 24, 2020
- International Business Machines Corporation
- RAVI K. BONAM
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DETERMINATION OF OPTICAL ROUGHNESS IN EUV STRUCTURES
- Publication number 20200301268
- Publication date Sep 24, 2020
- International Business Machines Corporation
- RAVI K. BONAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...
- Publication number 20200294968
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK PROCESS AWARE CALIBRATION USING MASK PATTERN FIDELITY INSPECTIONS
- Publication number 20200150629
- Publication date May 14, 2020
- International Business Machines Corporation
- Ravi K. Bonam
- G05 - CONTROLLING REGULATING
Information Patent Application
Care Area Generation By Detection Optimized Methodology
- Publication number 20190065634
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Ravi K. Bonam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Resist Having Tuned Interface Hardmask Layer For EUV Exposure
- Publication number 20180166277
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resist Having Tuned Interface Hardmask Layer For EUV Exposure
- Publication number 20180166278
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTOEMISSION SOURCES AND SCALABLE PHOTOEMISSION STRUCTURES
- Publication number 20160181050
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTOEMISSION SOURCES AND SCALABLE PHOTOEMISSION STRUCTURES
- Publication number 20150255241
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING THREE-DIMENSIONAL NANO-SCALE STRUCTURES AND...
- Publication number 20140191375
- Publication date Jul 10, 2014
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- John G. Hartley
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ravi K. Bonam

Person

Patents Grantslast 30 patents

Secure fingerprinting of a trusted photomask

Electronic package structure with offset stacked chips and top and...

Direct bonded heterogeneous integration silicon bridge

Determination of optical roughness in EUV structures

Determination of optical roughness in EUV structures

Three-dimensional microelectronic package with embedded cooling cha...

Cu—Cu bonding for interconnects on bridge chip attached to chips an...

Micro-fluidic channels having various critical dimensions

Semiconductor wafer having trenches with varied dimensions for mult...

Multiple chip bridge connector

Planar wafer level fan-out of multi-chip modules having different s...

Three-dimensional microelectronic package with embedded cooling cha...

Mask process aware calibration using mask pattern fidelity inspections

Care area generation by detection optimized methodology

Resist having tuned interface hardmask layer for EUV exposure

Resist having tuned interface hardmask layer for EUV exposure

Resist having tuned interface hardmask layer for EUV exposure

Integrated photoemission sources and scalable photoemission structures

Integrated photoemission sources and scalable photoemission structures

Methods for fabricating three-dimensional nano-scale structures and...

Patents Applicationslast 30 patents

Electronic Package Structure With Offset Stacked Chips And Top And...

SECURE FINGERPRINTING OF A TRUSTED PHOTOMASK

DETERMINATION OF OPTICAL ROUGHNESS IN EUV STRUCTURES

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...

THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...

PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...

MULTIPLE CHIP BRIDGE CONNECTOR

SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...

MICRO-FLUIDIC CHANNELS HAVING VARIOUS CRITICAL DIMENSIONS

DETERMINATION OF OPTICAL ROUGHNESS IN EUV STRUCTURES

THREE-DIMENSIONAL MICROELECTRONIC PACKAGE WITH EMBEDDED COOLING CHA...

MASK PROCESS AWARE CALIBRATION USING MASK PATTERN FIDELITY INSPECTIONS

Care Area Generation By Detection Optimized Methodology

Resist Having Tuned Interface Hardmask Layer For EUV Exposure

Resist Having Tuned Interface Hardmask Layer For EUV Exposure

INTEGRATED PHOTOEMISSION SOURCES AND SCALABLE PHOTOEMISSION STRUCTURES

INTEGRATED PHOTOEMISSION SOURCES AND SCALABLE PHOTOEMISSION STRUCTURES

METHODS FOR FABRICATING THREE-DIMENSIONAL NANO-SCALE STRUCTURES AND...