Ravi Kiran Chilukuri

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Cary, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component package fabrication method and structure
- Patent number 8,552,557
- Issue date Oct 8, 2013
- Amkor Technology, Inc.
- Sundeep Nand Nangalia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped chip package
- Patent number 8,426,966
- Issue date Apr 23, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped chip package fabrication method and structure
- Patent number 8,263,486
- Issue date Sep 11, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped chip package fabrication method and structure
- Patent number 7,994,045
- Issue date Aug 9, 2011
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CASCADE THERMOELECTRIC MODULE CONFIGURABLE FOR EITHER COMMON OR SEP...
- Publication number 20160079510
- Publication date Mar 17, 2016
- PHONONIC DEVICES, INC.
- Devon Newman
- H01 - BASIC ELECTRIC ELEMENTS