Ravi PRASHER

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for cooling an integrated circuit die with coolant flow in a...
- Patent number 7,957,137
- Issue date Jun 7, 2011
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling an integrated circuit die with coolant flow in a microchann...
- Patent number 7,633,752
- Issue date Dec 15, 2009
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 7,576,432
- Issue date Aug 18, 2009
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropin heat exchanger
- Patent number 7,498,672
- Issue date Mar 3, 2009
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro channels and manifold/plenum using separate silico...
- Patent number 7,435,623
- Issue date Oct 14, 2008
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropin heat exchanger
- Patent number 7,365,980
- Issue date Apr 29, 2008
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coolant capable of enhancing corrosion inhibition, system containin...
- Patent number 7,309,453
- Issue date Dec 18, 2007
- Intel Corporation
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit coolant microchannel assembly with targeted chan...
- Patent number 7,259,965
- Issue date Aug 21, 2007
- Intel Corporation
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Reworkable thermal interface material
- Patent number 7,253,523
- Issue date Aug 7, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit coolant microchannel with compliant cover
- Patent number 7,243,705
- Issue date Jul 17, 2007
- Intel Corporation
- Alan M. Myers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management arrangement with a low heat flux channel flow co...
- Patent number 7,218,519
- Issue date May 15, 2007
- Intel Corporation
- Ravi S. Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing distributed fluid flows in a the...
- Patent number 7,212,405
- Issue date May 1, 2007
- Intel Corporation
- Ravi S. Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated stacked microchannel heat exchanger and heat spreader
- Patent number 7,115,987
- Issue date Oct 3, 2006
- Intel Corporation
- Ven R. Holalkere
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for using fluid laden with nanoparticles for application...
- Patent number 7,104,313
- Issue date Sep 12, 2006
- Intel Corporation
- Himanshu Pokharna
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
IC die with directly bonded liquid cooling device
- Patent number 7,071,552
- Issue date Jul 4, 2006
- Intel Corporation
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel heat exchanger for a component in a mobile system
- Patent number 7,031,159
- Issue date Apr 18, 2006
- Intel Corporation
- Eric DiStefano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 6,992,381
- Issue date Jan 31, 2006
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro channels and manifold/plenum using separate silico...
- Patent number 6,992,382
- Issue date Jan 31, 2006
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-osmotic pumps and micro-channels
- Patent number 6,981,849
- Issue date Jan 3, 2006
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Micro-channel heat exchangers and spreaders
- Patent number 6,934,154
- Issue date Aug 23, 2005
- Intel Corporation
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase pumped liquid loop for mobile computer cooling
- Patent number 6,906,919
- Issue date Jun 14, 2005
- Intel Corporation
- Himanshu Pokharna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-phase cooling utilizing microchannel heat exchangers and channe...
- Patent number 6,903,929
- Issue date Jun 7, 2005
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel heat exchanger for a component in a mobile system
- Patent number 6,903,930
- Issue date Jun 7, 2005
- Intel Corporation
- Eric DiStefano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of heat extraction from an integrated circuit die
- Patent number 6,751,837
- Issue date Jun 22, 2004
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectrically cooling electronic devices
- Patent number 6,696,635
- Issue date Feb 24, 2004
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,661,660
- Issue date Dec 9, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,639,799
- Issue date Oct 28, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct heatpipe attachment to die using center point loading
- Patent number 6,625,022
- Issue date Sep 23, 2003
- Intel Corporation
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having a heat pipe that conducts heat from a se...
- Patent number 6,535,386
- Issue date Mar 18, 2003
- Intel Corporation
- Ajit V. Sathe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal cooling apparatus
- Patent number 6,504,721
- Issue date Jan 7, 2003
- Intel Corporation
- Abhay Watwe
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE APPLICATIONS
- Publication number 20180366629
- Publication date Dec 20, 2018
- Sheetak, Inc.
- Uttam GHOSHAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE APPLICATIONS
- Publication number 20160372650
- Publication date Dec 22, 2016
- Sheetak Inc.
- Uttam GHOSHAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUEL-FLEXIBLE THERMAL POWER GENERATOR FOR ELECTRIC LOADS
- Publication number 20160133814
- Publication date May 12, 2016
- Sheetak, Inc.
- Uttam GHOSHAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANN...
- Publication number 20100046167
- Publication date Feb 25, 2010
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package including thermally conductive sealant betw...
- Publication number 20080237843
- Publication date Oct 2, 2008
- Ashish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing burst-related hazards in microelectronic cooling systems
- Publication number 20080006389
- Publication date Jan 10, 2008
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method, apparatus and system for carbon nanotube wick structures
- Publication number 20070284089
- Publication date Dec 13, 2007
- Intel Corporation
- Unnikrishnan Vadakkanmaruveedu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLANT CAPABLE OF ENHANCING CORROSION INHIBITION, SYSTEM CONTAININ...
- Publication number 20070262286
- Publication date Nov 15, 2007
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT COOLANT MICROCHANNEL WITH COMPLIANT COVER
- Publication number 20070230116
- Publication date Oct 4, 2007
- Alan M. Myers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH TARGETED CHAN...
- Publication number 20070217147
- Publication date Sep 20, 2007
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
High pressure pump for cooling electronics
- Publication number 20070020107
- Publication date Jan 25, 2007
- Ioan Sauciuc
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Integrated stacked microchannel heat exchanger and heat spreader
- Publication number 20060244127
- Publication date Nov 2, 2006
- Ven R. Holalkere
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated circuit coolant microchannel assembly with targeted chan...
- Publication number 20060226539
- Publication date Oct 12, 2006
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated circuit coolant microchannel with compliant cover
- Publication number 20060196646
- Publication date Sep 7, 2006
- Alan M. Myers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat flux based microchannel heat exchanger architecture for two ph...
- Publication number 20060137860
- Publication date Jun 29, 2006
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatus and associated method for microelectronic cooling
- Publication number 20060131003
- Publication date Jun 22, 2006
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated micro channels and manifold/plenum using separate silico...
- Publication number 20060071326
- Publication date Apr 6, 2006
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20060055030
- Publication date Mar 16, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal management arrangement with channels structurally adapted f...
- Publication number 20050285261
- Publication date Dec 29, 2005
- Ravi S. Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal management arrangement with a low heat flux channel flow co...
- Publication number 20050276014
- Publication date Dec 15, 2005
- Ravi S. Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing distributed fluid flows in a the...
- Publication number 20050264997
- Publication date Dec 1, 2005
- Ravi S. Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Cooling an integrated circuit die with coolant flow in a microchann...
- Publication number 20050213301
- Publication date Sep 29, 2005
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC die with directly bonded liquid cooling device
- Publication number 20050212121
- Publication date Sep 29, 2005
- Kramadhati V. Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional nanotube structure
- Publication number 20050169831
- Publication date Aug 4, 2005
- Stephen W. Montgomery
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
Integrated micro channels and manifold/plenum using separate silico...
- Publication number 20050151244
- Publication date Jul 14, 2005
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parallel heat exchanger for a component in a mobile system
- Publication number 20050146852
- Publication date Jul 7, 2005
- Eric DiStefano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Folded fin microchannel heat exchanger
- Publication number 20050141195
- Publication date Jun 30, 2005
- Himanshu Pokharna
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatus for using fluid laden with nanoparticles for application...
- Publication number 20050139345
- Publication date Jun 30, 2005
- Himanshu Pokharna
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated stacked microchannel heat exchanger and heat spreader
- Publication number 20050139992
- Publication date Jun 30, 2005
- Ven R. Holalkere
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Channeled heat sink and chassis with integrated heat rejecter for t...
- Publication number 20050117299
- Publication date Jun 2, 2005
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL

Ravi PRASHER

Person

Patents Grantslast 30 patents

Method for cooling an integrated circuit die with coolant flow in a...

Cooling an integrated circuit die with coolant flow in a microchann...

Using external radiators with electroosmotic pumps for cooling inte...

Micropin heat exchanger

Integrated micro channels and manifold/plenum using separate silico...

Micropin heat exchanger

Coolant capable of enhancing corrosion inhibition, system containin...

Integrated circuit coolant microchannel assembly with targeted chan...

Reworkable thermal interface material

Integrated circuit coolant microchannel with compliant cover

Thermal management arrangement with a low heat flux channel flow co...

Method and apparatus for providing distributed fluid flows in a the...

Integrated stacked microchannel heat exchanger and heat spreader

Apparatus for using fluid laden with nanoparticles for application...

IC die with directly bonded liquid cooling device

Parallel heat exchanger for a component in a mobile system

Using external radiators with electroosmotic pumps for cooling inte...

Integrated micro channels and manifold/plenum using separate silico...

Electro-osmotic pumps and micro-channels

Micro-channel heat exchangers and spreaders

Two-phase pumped liquid loop for mobile computer cooling

Two-phase cooling utilizing microchannel heat exchangers and channe...

Parallel heat exchanger for a component in a mobile system

Method of heat extraction from an integrated circuit die

Thermoelectrically cooling electronic devices

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Direct heatpipe attachment to die using center point loading

Electronic assembly having a heat pipe that conducts heat from a se...

Thermal cooling apparatus

Patents Applicationslast 30 patents

THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE APPLICATIONS

THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE APPLICATIONS

FUEL-FLEXIBLE THERMAL POWER GENERATOR FOR ELECTRIC LOADS

COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANN...

Microelectronic package including thermally conductive sealant betw...

Preventing burst-related hazards in microelectronic cooling systems

Method, apparatus and system for carbon nanotube wick structures

COOLANT CAPABLE OF ENHANCING CORROSION INHIBITION, SYSTEM CONTAININ...

INTEGRATED CIRCUIT COOLANT MICROCHANNEL WITH COMPLIANT COVER

INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH TARGETED CHAN...

High pressure pump for cooling electronics

Integrated stacked microchannel heat exchanger and heat spreader

Integrated circuit coolant microchannel assembly with targeted chan...

Integrated circuit coolant microchannel with compliant cover

Heat flux based microchannel heat exchanger architecture for two ph...

Apparatus and associated method for microelectronic cooling

Integrated micro channels and manifold/plenum using separate silico...

Using external radiators with electroosmotic pumps for cooling inte...

Thermal management arrangement with channels structurally adapted f...

Thermal management arrangement with a low heat flux channel flow co...

Method and apparatus for providing distributed fluid flows in a the...

Cooling an integrated circuit die with coolant flow in a microchann...

IC die with directly bonded liquid cooling device

Three-dimensional nanotube structure

Integrated micro channels and manifold/plenum using separate silico...

Parallel heat exchanger for a component in a mobile system

Folded fin microchannel heat exchanger

Apparatus for using fluid laden with nanoparticles for application...

Integrated stacked microchannel heat exchanger and heat spreader

Channeled heat sink and chassis with integrated heat rejecter for t...