Ravikumar Adimula

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Package including at least one topological feature on an encapsulan...
- Patent number 8,653,675
- Issue date Feb 18, 2014
- Micron Technology, Inc.
- James Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die building block for stacked-die package
- Patent number 8,344,491
- Issue date Jan 1, 2013
- Micron Technology, Inc.
- Ravikumar Adimula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULAN...
- Publication number 20110127642
- Publication date Jun 2, 2011
- James Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
- Publication number 20100167466
- Publication date Jul 1, 2010
- Ravikumar Adimula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-DIE BUILDING BLOCK FOR STACKED-DIE PACKAGE
- Publication number 20100164085
- Publication date Jul 1, 2010
- Ravikumar Adimula
- H01 - BASIC ELECTRIC ELEMENTS