Ravinder K. Sharma

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming an electrically conductive polymer bump over an a...
- Patent number 5,674,780
- Issue date Oct 7, 1997
- Motorola, Inc.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect system for a semiconductor chip and a substrate
- Patent number 5,411,400
- Issue date May 2, 1995
- Motorola, Inc.
- Ravichandran Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallization scheme for semiconductor devices
- Patent number 4,946,376
- Issue date Aug 7, 1990
- Motorola, Inc.
- Ravinder K. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization scheme providing adhesion and barrier properties
- Patent number 4,927,505
- Issue date May 22, 1990
- Motorola Inc.
- Ravinder K. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization scheme providing adhesion and barrier properties
- Patent number 4,880,708
- Issue date Nov 14, 1989
- Motorola, Inc.
- Ravinder K. Sharma
- H01 - BASIC ELECTRIC ELEMENTS