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Ravindhar K. Kaw
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Los Altos, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit incorporating flip chip and wire bonding
Patent number
7,262,508
Issue date
Aug 28, 2007
Avago Technologies General IP (Singapore) Pte. Ltd.
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with copper interconnect and top level bonding/i...
Patent number
7,202,546
Issue date
Apr 10, 2007
Avago Technologies General IP (Singapore) Pte. Ltd.
Salvador Salcido, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligning infra-red communication link
Patent number
6,738,583
Issue date
May 18, 2004
Agilent Technologies, Inc.
Farid Matta
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Flex interconnect module
Patent number
5,065,280
Issue date
Nov 12, 1991
Hewlett-Packard Company
Marcos Karnezos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic semiconductor chip interconnection technique and arrange...
Patent number
5,021,869
Issue date
Jun 4, 1991
Hewlett-Packard Company
Ravindhar K. Kaw
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Integrated circuit with copper interconnect and top level bonding/i...
Publication number
20050082675
Publication date
Apr 21, 2005
Salvador Salcido
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit incorporating flip chip and wire bonding
Publication number
20050073054
Publication date
Apr 7, 2005
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS