Ravindra V. Tanikella

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 9,484,277
- Issue date Nov 1, 2016
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer grafting for enhanced dielectric and interconnect material...
- Patent number 9,147,603
- Issue date Sep 29, 2015
- Intel Corporation
- Chandramouleeswaran Subramani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 8,796,825
- Issue date Aug 5, 2014
- Intel Corporation
- Ravindra V. Tanikella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aligned nanotube bearing composite material
- Patent number 8,530,890
- Issue date Sep 10, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Aligned nanotube bearing composite material
- Patent number 8,222,750
- Issue date Jul 17, 2012
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 8,129,823
- Issue date Mar 6, 2012
- Intel Corporation
- Ravindra V. Tanikella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-attach films for chip-scale packaging, packages made therewith,...
- Patent number 7,816,487
- Issue date Oct 19, 2010
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,790,598
- Issue date Sep 7, 2010
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aligned nanotube bearing composite material
- Patent number 7,534,648
- Issue date May 19, 2009
- Intel Corporation
- Nachiket Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,517,788
- Issue date Apr 14, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 7,335,608
- Issue date Feb 26, 2008
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE COATING ON AN EDGE OF A GLASS CORE
- Publication number 20230087838
- Publication date Mar 23, 2023
- Intel Corporation
- Rahul N. MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SLEEVES AROUND TGVS FOR IMPROVED HEAT DISSIPAT...
- Publication number 20230088392
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT PROTECTION TO PREVENT CRACK PROPAGATION IN GLASS CORE SUBSTRAT...
- Publication number 20230092740
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391264
- Publication date Dec 16, 2021
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
- Publication number 20200245472
- Publication date Jul 30, 2020
- Intel Corporation
- Darko GRUJICIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLYMER GRAFTING FOR ENHANCED DIELECTRIC AND INTERCONNECT MATERIAL...
- Publication number 20150206793
- Publication date Jul 23, 2015
- Chandramouleeswaran Subramani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20140312101
- Publication date Oct 23, 2014
- RAVINDRA V. TANIKELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED NANOTUBE BEARING COMPOSIT MATERIAL
- Publication number 20120270008
- Publication date Oct 25, 2012
- Intel Corporation
- Nachiket Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20120181687
- Publication date Jul 19, 2012
- RAVINDRA V. TANIKELLA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING
- Publication number 20090196000
- Publication date Aug 6, 2009
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNED NANOTUBE BEARING COMPOSITE MATERIAL
- Publication number 20090192241
- Publication date Jul 30, 2009
- Nachiket Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Materials, structures and methods for microelectronic packaging
- Publication number 20080087986
- Publication date Apr 17, 2008
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Aligned nanotube bearing composite material
- Publication number 20080012155
- Publication date Jan 17, 2008
- Nachiket Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System, apparatus, and method for advanced solder bumping
- Publication number 20070152024
- Publication date Jul 5, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate core polymer nanocomposite with nanoparticles and randoml...
- Publication number 20070096083
- Publication date May 3, 2007
- Intel Corporation
- Nachiket Raravikar
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Die-attach films for chip-scale packaging, packages made therewith,...
- Publication number 20060073624
- Publication date Apr 6, 2006
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Materials, structures and methods for microelectronic packaging
- Publication number 20060060956
- Publication date Mar 23, 2006
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ravindra V. Tanikella

Person

Patents Grantslast 30 patents

Apparatus with a substrate provided with plasma treatment

Semiconductor device having polyimide layer

Materials, structures and methods for microelectronic packaging

Polymer grafting for enhanced dielectric and interconnect material...

Materials, structures and methods for microelectronic packaging

Aligned nanotube bearing composite material

Aligned nanotube bearing composite material

Materials, structures and methods for microelectronic packaging

Die-attach films for chip-scale packaging, packages made therewith,...

System, apparatus, and method for advanced solder bumping

Aligned nanotube bearing composite material

System, apparatus, and method for advanced solder bumping

Materials, structures and methods for microelectronic packaging

Patents Applicationslast 30 patents

PROTECTIVE COATING ON AN EDGE OF A GLASS CORE

THERMALLY CONDUCTIVE SLEEVES AROUND TGVS FOR IMPROVED HEAT DISSIPAT...

MOAT PROTECTION TO PREVENT CRACK PROPAGATION IN GLASS CORE SUBSTRAT...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT

POLYMER GRAFTING FOR ENHANCED DIELECTRIC AND INTERCONNECT MATERIAL...

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

ALIGNED NANOTUBE BEARING COMPOSIT MATERIAL

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING

ALIGNED NANOTUBE BEARING COMPOSITE MATERIAL

Materials, structures and methods for microelectronic packaging

Aligned nanotube bearing composite material

System, apparatus, and method for advanced solder bumping

Substrate core polymer nanocomposite with nanoparticles and randoml...

Die-attach films for chip-scale packaging, packages made therewith,...

Materials, structures and methods for microelectronic packaging