Ray Chien

Person

Hsin Tien City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
SOI single crystalline chip structure with multi-thickness silicon...
- Patent number 7,173,309
- Issue date Feb 6, 2007
- VIA Technologies Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-thickness active device layer SOI chip structure
- Patent number 7,141,855
- Issue date Nov 28, 2006
- VIA Technologies, Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module for an IC device and method of forming the same
- Patent number 7,081,405
- Issue date Jul 25, 2006
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SOI single crystalline chip structure
- Patent number 6,975,002
- Issue date Dec 13, 2005
- VIA Technologies, Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LGA to PGA package adapter
- Patent number 6,971,886
- Issue date Dec 6, 2005
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket structure for grid array (GA) packages
- Patent number 6,890,186
- Issue date May 10, 2005
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastomer interposer for grid array packages and method of manufact...
- Patent number 6,841,882
- Issue date Jan 11, 2005
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket structure for grid array (GA) packages
- Patent number 6,672,882
- Issue date Jan 6, 2004
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package module and method of forming the same
- Patent number 6,639,324
- Issue date Oct 28, 2003
- VIA Technologies, Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a cavity-down plastic ball grid array (CD-P...
- Patent number 6,566,166
- Issue date May 20, 2003
- VIA Technologies Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOI SINGLE CRYSTALLINE CHIP STRUCTURE
- Publication number 20050236670
- Publication date Oct 27, 2005
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-thickness active device layer SOI chip structure
- Publication number 20050236669
- Publication date Oct 27, 2005
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package module for an IC device and method of forming the same
- Publication number 20050040525
- Publication date Feb 24, 2005
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOI single crystalline chip structure with multi-thickness silicon...
- Publication number 20040217438
- Publication date Nov 4, 2004
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adapter assembly
- Publication number 20040038562
- Publication date Feb 26, 2004
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Socket structure for grid array (GA) packages
- Publication number 20030232519
- Publication date Dec 18, 2003
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package module for an IC device and method of forming the same
- Publication number 20030168256
- Publication date Sep 11, 2003
- Via Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal pad of a semiconductor element
- Publication number 20030146483
- Publication date Aug 7, 2003
- Via Technologies, Inc.
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer interposer for grid array packages and method of manufact...
- Publication number 20030146510
- Publication date Aug 7, 2003
- Ray Chien
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Socket structure for grid array (GA) packages
- Publication number 20020090843
- Publication date Jul 11, 2002
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a cavity-down plastic ball grid array (CD-P...
- Publication number 20020009826
- Publication date Jan 24, 2002
- Ray Chien
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

SOI single crystalline chip structure with multi-thickness silicon...

Dual-thickness active device layer SOI chip structure

Package module for an IC device and method of forming the same

SOI single crystalline chip structure

LGA to PGA package adapter

Socket structure for grid array (GA) packages

Elastomer interposer for grid array packages and method of manufact...

Socket structure for grid array (GA) packages

Flip chip package module and method of forming the same

Method of manufacturing a cavity-down plastic ball grid array (CD-P...

Patents Applicationslast 30 patents

SOI SINGLE CRYSTALLINE CHIP STRUCTURE

Dual-thickness active device layer SOI chip structure

Package module for an IC device and method of forming the same

SOI single crystalline chip structure with multi-thickness silicon...

Adapter assembly

Socket structure for grid array (GA) packages

Package module for an IC device and method of forming the same

Metal pad of a semiconductor element

Elastomer interposer for grid array packages and method of manufact...

Socket structure for grid array (GA) packages

Method of manufacturing a cavity-down plastic ball grid array (CD-P...