Ray D. Harrison

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Garland, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Repackaging semiconductor IC devices for failure analysis
- Patent number 6,521,479
- Issue date Feb 18, 2003
- Texas Instruments Incorporated
- Ray D. Harrison
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Laterally Interconnected IC Packages and Methods
- Publication number 20080157320
- Publication date Jul 3, 2008
- Ray D. Harrison
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
High density vertically stacked semiconductor device
- Publication number 20050173807
- Publication date Aug 11, 2005
- Jianbai Zhu
- H01 - BASIC ELECTRIC ELEMENTS