TREA

Ray Fredric Solis de ASIS

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  • Mabalacat City, PH
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plated walls defining mold compound cavities
    • Patent number 11,942,387
    • Issue date Mar 26, 2024
    • Texas Instruments Incorporated
    • John Carlo Cruz Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Textured bond pads
    • Patent number 11,600,583
    • Issue date Mar 7, 2023
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Textured bond pads
    • Patent number 11,081,456
    • Issue date Aug 3, 2021
    • Texas Instruments Incorporated
    • Rafael Jose Lizares Guevara
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING
    • Publication number 20250006683
    • Publication date Jan 2, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo C Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bulk Acoustic Wave (BAW) Microresonator Package
    • Publication number 20240322786
    • Publication date Sep 26, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Molina
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    PLATED WALLS DEFINING MOLD COMPOUND CAVITIES
    • Publication number 20240243027
    • Publication date Jul 18, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Cruz MOLINA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR
    • Publication number 20240203801
    • Publication date Jun 20, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SECURITY WIRE OVER STITCH BOND
    • Publication number 20240128228
    • Publication date Apr 18, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Aniceto Rabilas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPLIT SEMICONDUCTOR PACKAGE
    • Publication number 20230411265
    • Publication date Dec 21, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED WALLS DEFINING MOLD COMPOUND CAVITIES
    • Publication number 20230095185
    • Publication date Mar 30, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Cruz MOLINA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Textured Bond Pads
    • Publication number 20210320074
    • Publication date Oct 14, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TEXTURED BOND PADS
    • Publication number 20210066220
    • Publication date Mar 4, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Rafael Jose Lizares GUEVARA
    • H01 - BASIC ELECTRIC ELEMENTS