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Ray Young

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  • Kalispell, MT, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer profiling for etching system
    • Patent number 11,501,986
    • Issue date Nov 15, 2022
    • Applied Materials, Inc.
    • Jeffrey Chi Cheung
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROFILING FOR ETCHING SYSTEM
    • Publication number 20230065641
    • Publication date Mar 2, 2023
    • Applied Materials, Inc.
    • Jeffrey Chi Cheung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROFILING FOR ETCHING SYSTEM
    • Publication number 20170323806
    • Publication date Nov 9, 2017
    • Jeffrey Chi Cheung
    • H01 - BASIC ELECTRIC ELEMENTS