Raymond A. Frechette

Person

North Providence, RI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming an etched soft edge metal foil and the product t...
- Patent number 7,591,955
- Issue date Sep 22, 2009
- Interplex Nas, Inc.
- Raymond A. Frechette
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flex circuit substrate for an integrated circuit package
- Patent number 6,365,974
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip mold seal
- Patent number 6,302,672
- Issue date Oct 16, 2001
- Texas Instruments Incorporated
- Raymond A. Frechette
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit chip mold seal
- Patent number 6,302,673
- Issue date Oct 16, 2001
- Texas Instruments Incorporated
- Raymond A. Frechette
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dambarless leadframe for molded component encapsulation
- Patent number 5,949,132
- Issue date Sep 7, 1999
- Texas Instruments Incorporated
- Jeremias L. Libres
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit chip mold seal
- Patent number 5,942,178
- Issue date Aug 24, 1999
- Texas Instruments Incorporated
- Raymond A. Frechette
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming flat inner lead tips on lead frame
- Patent number 5,904,503
- Issue date May 18, 1999
- Texas Instruments Incorporated
- Raymond A. Frechette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dambarless leadframe for molded component encapsulation
- Patent number 5,891,377
- Issue date Apr 6, 1999
- Texas Instruments Incorporated
- Jeremias L. Libres
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ceramic coated plastic package
- Patent number 5,672,915
- Issue date Sep 30, 1997
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for IC devices with strengthened encapsulation...
- Patent number 5,633,528
- Issue date May 27, 1997
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuits
- Patent number 5,610,437
- Issue date Mar 11, 1997
- Texas Instruments Incorporated
- Raymond A. Frechette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for IC devices with strengthened encapsulation...
- Patent number 5,429,992
- Issue date Jul 4, 1995
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a coated plastic package
- Patent number 5,302,553
- Issue date Apr 12, 1994
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a thin film solar cell
- Patent number 5,264,376
- Issue date Nov 23, 1993
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit
- Patent number 4,868,635
- Issue date Sep 19, 1989
- Texas Instruments Incorporated
- Raymond A. Frechette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beryllium copper plating process
- Patent number 4,028,064
- Issue date Jun 7, 1977
- Texas Instruments Incorporated
- Stephen Cassidy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
High Density Interconnection Device With Dielectric Coating
- Publication number 20080171474
- Publication date Jul 17, 2008
- Interplex NAS, Inc.
- Ralph Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ETCHED SOFT EDGE METAL FOIL AND THE PRODUCT T...
- Publication number 20070157762
- Publication date Jul 12, 2007
- Interplex NAS, Inc.
- Raymond A. Frechette
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Raymond A. Frechette

Person

Patents Grantslast 30 patents

Method for forming an etched soft edge metal foil and the product t...

Flex circuit substrate for an integrated circuit package

Integrated circuit chip mold seal

Integrated circuit chip mold seal

Dambarless leadframe for molded component encapsulation

Integrated circuit chip mold seal

Method of forming flat inner lead tips on lead frame

Dambarless leadframe for molded component encapsulation

Ceramic coated plastic package

Lead frame structure for IC devices with strengthened encapsulation...

Lead frame for integrated circuits

Lead frame structure for IC devices with strengthened encapsulation...

Method of forming a coated plastic package

Method of making a thin film solar cell

Lead frame for integrated circuit

Beryllium copper plating process

Patents Applicationslast 30 patents

High Density Interconnection Device With Dielectric Coating

METHOD FOR FORMING AN ETCHED SOFT EDGE METAL FOIL AND THE PRODUCT T...