Raymond A. Krick

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Package-level backside metallization (BSM)
- Patent number 11,652,061
- Issue date May 16, 2023
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,239,973
- Issue date May 29, 2001
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,043,983
- Issue date Mar 28, 2000
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
- Publication number 20200395307
- Publication date Dec 17, 2020
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS