Raymond Albert Narvadez

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Santa Rosa, PH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,688,715
- Issue date Jun 27, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,152,326
- Issue date Oct 19, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having a conductive layer protruding through a lead recess
- Patent number 10,796,984
- Issue date Oct 6, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20220005782
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20200135686
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20190148271
- Publication date May 16, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20180190575
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS