Raymond C. Wells

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gradient chuck method for wafer bonding employing a convex pressure
- Patent number RE36890
- Issue date Oct 3, 2000
- Motorola, Inc.
- Raymond C. Wells
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Method of bonding a semiconductor wafer
- Patent number 6,113,721
- Issue date Sep 5, 2000
- Motorola, Inc.
- Frank T. Secco d'Aragona
- B24 - GRINDING POLISHING
Information Patent Grant
Direct wafer bonded structure method of making
- Patent number 5,413,952
- Issue date May 9, 1995
- Motorola, Inc.
- Irenee Pages
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for single sided polishing of a semiconductor wafer
- Patent number 5,389,579
- Issue date Feb 14, 1995
- Motorola, Inc.
- Raymond C. Wells
- B24 - GRINDING POLISHING
Information Patent Grant
Automated method for joining wafers
- Patent number 5,314,107
- Issue date May 24, 1994
- Motorola, Inc.
- Frank S. d'Aragona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making dielectric and conductive isolated island
- Patent number 5,268,326
- Issue date Dec 7, 1993
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient chuck method for wafer bonding employing a convex pressure
- Patent number 5,131,968
- Issue date Jul 21, 1992
- Motorola, Inc.
- Raymond C. Wells
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wire saw machine
- Patent number 4,655,191
- Issue date Apr 7, 1987
- Motorola, Inc.
- Raymond C. Wells
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw
- Patent number 4,494,523
- Issue date Jan 22, 1985
- Motorola, Inc.
- Raymond C. Wells
- B28 - WORKING CEMENT, CLAY, OR STONE

Raymond C. Wells

Person

Patents Grantslast 30 patents

Gradient chuck method for wafer bonding employing a convex pressure

Method of bonding a semiconductor wafer

Direct wafer bonded structure method of making

Method for single sided polishing of a semiconductor wafer

Automated method for joining wafers

Method of making dielectric and conductive isolated island

Gradient chuck method for wafer bonding employing a convex pressure

Wire saw machine

Wire saw