Raymond J.M. Jao

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Miao-Li City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package without substrate and method of manufacturing...
- Patent number 6,770,959
- Issue date Aug 3, 2004
- Silconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch wafer bumping process
- Patent number 6,555,296
- Issue date Apr 29, 2003
- Siliconware Precision Industries Co., Ltd.
- Raymond Jao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having lead frame with an exposed base pad
- Patent number 6,114,752
- Issue date Sep 5, 2000
- Siliconware Precision Industries Co., LTD.
- Chion-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fine pitch wafer bumping process
- Publication number 20020146646
- Publication date Oct 10, 2002
- Raymond Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package without substrate and method of manufacturing...
- Publication number 20020074672
- Publication date Jun 20, 2002
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS