Raymond Joe

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer deposition of silicon and silicon-containing films
- Patent number 8,012,859
- Issue date Sep 6, 2011
- Tokyo Electron Limited
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst-assisted atomic layer deposition of silicon-containing fil...
- Patent number 7,964,441
- Issue date Jun 21, 2011
- Tokyo Electron Limited
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon germanium surface layer for high-k dielectric integration
- Patent number 7,737,051
- Issue date Jun 15, 2010
- Tokyo Electron Limited
- Anthony Dip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for extending time between chamber cleaning processes
- Patent number 7,604,841
- Issue date Oct 20, 2009
- Tokyo Electron Limited
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Batch photoresist dry strip and ash system and process
- Patent number 7,387,968
- Issue date Jun 17, 2008
- Tokyo Electron Limited
- Raymond Joe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an oxide layer
- Patent number 7,326,655
- Issue date Feb 5, 2008
- Tokyo Electron Limited
- Raymond Joe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-in self test for a thermal processing system
- Patent number 7,165,011
- Issue date Jan 16, 2007
- Tokyo Electron Limited
- Sanjeev Kaushal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature plasma-enhanced chemical vapor deposition of silico...
- Patent number 7,129,187
- Issue date Oct 31, 2006
- Tokyo Electron Limited
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer susceptor
- Patent number 7,022,192
- Issue date Apr 4, 2006
- Tokyo Electron Limited
- Anthony Dip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable semiconductor wafer susceptor
- Patent number 6,799,940
- Issue date Oct 5, 2004
- Tokyo Electron Limited
- Raymond Joe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CATALYST-ASSISTED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FIL...
- Publication number 20080241358
- Publication date Oct 2, 2008
- TOKYO ELECTON LIMITED
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BATCH PHOTORESIST DRY STRIP AND ASH SYSTEM AND PROCESS
- Publication number 20080210273
- Publication date Sep 4, 2008
- TOKYO ELECTRON LIMITED
- Raymond Joe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Exhaust buildup monitoring in semiconductor processing
- Publication number 20070189356
- Publication date Aug 16, 2007
- Jonathan Pettit
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Batch photoresist dry strip and ash system and process
- Publication number 20070105392
- Publication date May 10, 2007
- Raymond Joe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of forming an oxide layer
- Publication number 20070072438
- Publication date Mar 29, 2007
- TOKYO ELECTRON LIMITED
- Raymond Joe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-temperature plasma-enhanced chemical vapor deposition of silico...
- Publication number 20060014399
- Publication date Jan 19, 2006
- TOKYO ELECTRON LIMITED
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer heater assembly
- Publication number 20050217799
- Publication date Oct 6, 2005
- TOKYO ELECTRON LIMITED
- David L. O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for extending time between chamber cleaning processes
- Publication number 20050221001
- Publication date Oct 6, 2005
- Tokyo Electron Limited of TBS Broadcast Center
- Raymond Joe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon germanium surface layer for high-k dielectric integration
- Publication number 20050199877
- Publication date Sep 15, 2005
- Tokyo Electron Limited of TBS Broadcast Center
- Anthony Dip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple grow-etch cyclic surface treatment for substrate preparation
- Publication number 20050048742
- Publication date Mar 3, 2005
- TOKYO ELECTRON LIMITED
- Anthony Dip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable semiconductor wafer susceptor
- Publication number 20040109748
- Publication date Jun 10, 2004
- Raymond Joe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer susceptor
- Publication number 20040040510
- Publication date Mar 4, 2004
- Anthony Dip
- H01 - BASIC ELECTRIC ELEMENTS

Raymond Joe

Person

Patents Grantslast 30 patents

Atomic layer deposition of silicon and silicon-containing films

Catalyst-assisted atomic layer deposition of silicon-containing fil...

Silicon germanium surface layer for high-k dielectric integration

Method for extending time between chamber cleaning processes

Batch photoresist dry strip and ash system and process

Method of forming an oxide layer

Built-in self test for a thermal processing system

Low-temperature plasma-enhanced chemical vapor deposition of silico...

Semiconductor wafer susceptor

Removable semiconductor wafer susceptor

Patents Applicationslast 30 patents

CATALYST-ASSISTED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FIL...

BATCH PHOTORESIST DRY STRIP AND ASH SYSTEM AND PROCESS

Exhaust buildup monitoring in semiconductor processing

Batch photoresist dry strip and ash system and process

Method of forming an oxide layer

Low-temperature plasma-enhanced chemical vapor deposition of silico...

Wafer heater assembly

Method for extending time between chamber cleaning processes

Silicon germanium surface layer for high-k dielectric integration

Multiple grow-etch cyclic surface treatment for substrate preparation

Removable semiconductor wafer susceptor

Semiconductor wafer susceptor