Raymond Lee Lavoie JR.

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Elkton, MD, US

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Patents Applicationslast 30 patents

Information Patent Application
Polishing compositions for reducing erosion in semiconductor wafers
- Publication number 20060135045
- Publication date Jun 22, 2006
- Jinru Bian
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing compositions for controlling metal interconnect removal r...
- Publication number 20050194562
- Publication date Sep 8, 2005
- Raymond Lee Lavoie
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Compositions and methods for controlled polishing of copper
- Publication number 20050136670
- Publication date Jun 23, 2005
- Joseph G. Ameen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Control of removal rates in CMP
- Publication number 20020019202
- Publication date Feb 14, 2002
- Terence M. Thomas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...