Raymond Maldan Partosa

Person

Baguio City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Making a flip-chip assembly with bond fingers
- Patent number 9,219,052
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with bond fingers
- Patent number 8,766,461
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Raymond Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding a solder bump to a lead using compression and retraction fo...
- Patent number 8,381,967
- Issue date Feb 26, 2013
- Texas Instruments Incorporated
- Mutsumi Masumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for detecting warped carriers and associated methods
- Patent number 7,326,025
- Issue date Feb 5, 2008
- Texas Instruments Incorporated
- Ramil A. Viluan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond integrity test system
- Patent number 7,000,822
- Issue date Feb 21, 2006
- Texas Instruments Incorporated
- Allan I. Dacanay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating wire bond integrity test system
- Patent number 6,808,943
- Issue date Oct 26, 2004
- Texas Instruments Incorporated
- Allan I. Dacanay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous ceramic work stations for wire and die bonders
- Patent number 6,650,011
- Issue date Nov 18, 2003
- Texas Instruments Incorporated
- Raymond M. Partosa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
- Publication number 20140248746
- Publication date Sep 4, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BOND FINGERS
- Publication number 20140197534
- Publication date Jul 17, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for detecting warped carriers and associated methods
- Publication number 20050247541
- Publication date Nov 10, 2005
- Texas Instruments, Inc.
- Ramil A. Viluan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bond integrity test system
- Publication number 20050112787
- Publication date May 26, 2005
- Allan I. Dacanay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bond integrity test system
- Publication number 20030227016
- Publication date Dec 11, 2003
- Allan I. Dacanay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Porous ceramic work stations for wire and die bonders
- Publication number 20030140470
- Publication date Jul 31, 2003
- Raymond M. Partosa
- H01 - BASIC ELECTRIC ELEMENTS

Raymond Maldan Partosa

Person

Patents Grantslast 30 patents

Making a flip-chip assembly with bond fingers

Substrate with bond fingers

Bonding a solder bump to a lead using compression and retraction fo...

System for detecting warped carriers and associated methods

Wire bond integrity test system

Method of fabricating wire bond integrity test system

Porous ceramic work stations for wire and die bonders

Patents Applicationslast 30 patents

MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS

SUBSTRATE WITH BOND FINGERS

System for detecting warped carriers and associated methods

Wire bond integrity test system

Wire bond integrity test system

Porous ceramic work stations for wire and die bonders